中文網
Taipei
Sun, Oct 17, 2021
07:45
rain
22°C
CONNECT WITH US
NEWS TAGGED COG
Thursday 14 October 2021
Semiconductor materials distributors poised to enjoy strong 4Q21
Semiconductor materials distributors including Topco Scientific, Wah Lee Industrial and Niching Industrial are all set to see their fourth-quarter revenues stay high despite uncertainty...
Wednesday 11 August 2021
ChipMOS sees lucrative memory backend prospect for 2H21
Display driver IC and memory backend specialist ChipMOS Technologies is guardedly optimistic about its business prospects for the third quarter of 2021, with backend services for...
Tuesday 15 June 2021
DDI backend services, materials see order visibility throughout 2021
Display driver IC (DDI) backend specialists ChipMos Technologies and Chipbond Technology, and related COF and COG packaging materials vendors including Niching Industrial have seen...
Thursday 13 May 2021
DDI packaging materials demand stays robust
Demand for packaging materials for processing high-end display driver ICs (DDI) remains strong, as backend houses including Chipbond Technology and ChipMOS Technologies still maintain...
Tuesday 2 February 2021
DDI backend houses to further raise quotes later in 1Q21
Display driver IC (DDI) backend specialists including Chipbond Technology and ChipMOS Technologies plan to enforce a second wave of price hikes in late February or early March to...
Tuesday 13 October 2020
COF, COG packaging materials shipments ramping up
Taiwan's IC materials distributors including Niching Industrial have seen a significant surge in shipments of COF and COG packaging materials and thermal solutions since the third...
Thursday 28 May 2020
Backend material distributors warn of demand slowdown
IC fabrication and backend materials distributors are expected to face a slowdown in shipments starting third-quarter 2020 at the earliest due mainly to impacts of the coronavirus...
Monday 17 June 2019
Chipbond to suspend 5G PA packaging capacity expansion
Chipbond Technology will put on hold its 5G PA (power amplifier) packaging capacity expansion originally set to be enforced in the second half of 2019, due mainly to the uncertainties...
Tuesday 21 May 2019
Taiwan IC partners see unclear prospects for 2H19 shipments to Huawei
With the US trade sanctions likely to prove disastrous to Huawei, Taiwan semiconductor supply chain partners can hardly give clear-cut prospects for the third quarter of 2019 and...
Tuesday 2 April 2019
COG packaging demand picking up
COG (chip-on-glass) packaging demand has picked up recently as some Taiwan-based suppliers of TDDI (touch and display driver integrated) chips adopt the method to replace COF (chip-on-film)...
Wednesday 20 March 2019
Taiwan panel and driver IC firms to form COF substrate JV
Speculation has circulated recently in Taiwan's industry about a new company that will be set up jointly by the local LCD panel and driver IC companies to specialize in the manufacture...
Wednesday 22 August 2018
Driver IC backend firms ink 3-year supply contracts
Driver IC backend specialists have inked supply deals with several of their fabless clients, and have promised sufficient capacity for COF (chip-on-film) packaging over the next three...
Tuesday 24 July 2018
Orders for OLED driver ICs to boost Chipbond revenues in 2019-2020
Taiwan-based backend firm Chipbond Technology is expected to see revenues generated from orders for OLED panel driver ICs make a substantial contribution to company revenues in 2019...
Tuesday 20 March 2018
COF demand to receive boost in 2H18, says JMC
Chip-on-film (COF) packaging demand will start to grow substantially in the second half of 2018, driven by the arrival of new smartphones featuring an edge-to-edge display, according...
Wednesday 17 January 2018
ChipMOS lands orders from new clients for gold bumping services
Taiwan-based IC packager ChipMOS is expected to see its revenue growth significantly driven by the combination of its gold bumping with COF packaging services in 2018, as the company...