Automotive chips and power devices continue to see uneven supplies, and Taiwan's leading OSATs including ASE Technology and international IDMs such as Infineon, Renesas, NXP, ST Microelectronics...
Regional politics will become a new variable to the development of the semiconductor industry in the next decade, and semiconductor players should manage to learn its unpredictability...
The Taiwan government is looking to actively support local suppliers engaged in the production of third-generation compound semiconductors, such as GlobalWafers, Hermes-Epitek, and...
Challenges such as entry barriers for substrates and other raw materials, and rising production costs are facing Taiwan's compound semiconductor industry supply chain, according to...
On August 12, the Bureau of Industry and Security, under the US Department of Commerce, established export controls on four technologies considered emerging and foundational. Among...
Third-generation compound semiconductors such as SiC and GaN are very crucial to the future development of electrical vehicles (EV) and green power industries, and heterogeneous integration...
IDMs have been promoting their integrated GaN chip solutions, and may step up outsourcing the production of such devices to satisfy growing demand, according to industry sources.
Metaverse hardware is seen as the next "killer app" for the 3D optical sensor market, prompting compound semiconductor and optical sensor suppliers to team up to develop metaverse...
Slowdowns in handsets and other consumer electronics areas have prompted brand device vendors to accelerate their pace of inventory correction, but the vendors and core chip suppliers...
Taiwan-based power management IC (PMIC) suppliers have shifted their focus away from the consumer electronics market, where their China-based peers are growing their presence, according...
IC analysis and inspection lab Material Science Service (MSScorps) is upbeat about its longer-term business prospects, citing brisk demand for advanced packaging and third-generation...
High heat dissipation and other thermal management technologies are increasingly required for both front- and back-end chipmaking processes by companies engaged in the automotive,...
Automotive diode vendor Actron Technology has set a five-year business development roadmap, aiming to have its shipments for NEV (new energy vehicle) applications catch up with those...
