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NEWS TAGGED CONSUMER ELECTRONICS
Tuesday 7 September 2021
IDMs migrate to 8-inch wafer fabrication for 3rd-gen semiconductors
IDMs including Infineon, Rohm and STMicroelectronics are transitioning to 8-inch wafer fabrication for third-generation semiconductors such as GaN and SiC, according to industry so...
Monday 6 September 2021
Taiwan firms continue to hike car-use MOSFET wafer thinning quotes
Taiwan's wafer thinning specialists including Phoenix Silicon International (PSI), Chipbond Technology and Integrated Service Technology (iST) have seen clear order visibility through...
Friday 3 September 2021
MediaTek likely to post revenue decrease in 4Q21
MediaTek is likely to see its revenues fall sequentially, for the first time in more than one year, in the fourth quarter of 2021, given that its fulfillment of orders for the quarter...
Monday 30 August 2021
BT substrate demand for wire-bonding, memory chips to stay strong till 1Q22
BT substrates for wire-bonding use or memory chips processing are expected to stay in robust demand till at least the first quarter of 2022, and those for processing higher-end handset...
Wednesday 25 August 2021
Leadframe demand for car power modules promising in next 2-3 years
Taiwan-based leadframe makers Shuen Der Industry (SDI) and Jih Lin Technology are optimistic about shipments for automotive power components and modules over the next two to three...
Monday 23 August 2021
Demand for photo couplers remains high in 2H21
Photo couplers have been in strong demand since early 2021 and the robust demand will remain in the second half of 2021, with shipments for orders scheduled until the end of the year,...
Wednesday 18 August 2021
Compal acquires Indiana factory from Cal-Comp for car electronics
Compal Electronics has announced that it is acquiring 100% Cal-Comp USA (Indiana)'s shares. Cal-Comp Indiana is the sub-subsidiary of Cal-Comp Thailand. Now Compal and Cal-Comp belong...
Thursday 12 August 2021
Taiwan analog IC suppliers may gain shifted orders from US
A US analog chip vendor reportedly intends to scale down its target markets due to the limited available fab capacity, with smaller Taiwan-based peers set to embrace orders shifted...
Wednesday 11 August 2021
DRAM contract prices likely to stay flat in 4Q21
DRAM contract prices have risen at a slower pace in the third quarter, and are expected to stay flat or drop slightly in the fourth quarter, according to industry sources.
Friday 30 July 2021
Flexium expects to score record revenues of NT$10 billion in 3Q21
Taiwan's flexible PCB specialist Flexium Interconnect expects its revenues for third-quarter 2021 to hit a record high of NT$10 billion (US$358.3 million), buoyed by a surge in shipments...
Tuesday 27 July 2021
SK Hynix posts profit surge in 2Q21
SK Hynix has reported net profits surged 100% sequentially and 57% on year to KRW1.99 trillion (US$1.73 billion) in the second quarter of 2021.
Tuesday 27 July 2021
FPCB firm Career Tech sees shipments ramp up
Career Technology, which specializes in flexible PCBs, has seen shipments for consumer electronics products ramp up thanks to seasonal factors. Shipments for handsets, notebooks and...
Friday 23 July 2021
Wire-bonding quotes to hike again in 1H22 as materials costs surge
OSATs are expected to raise their quotes again for wire-bonding packaging services in the first half of 2022 to reflect ever-rising costs for materials such as leadframes and molding...
Thursday 22 July 2021
DDR3 prices to continue double-digit growth
Niche-market DDR3 memory prices will continue to register double-digit increases in the third and fourth quarters of 2021, due mainly to supply-side constraints, according to industry...
Wednesday 21 July 2021
Compeq keenly exploring PCB for non-CE applications
Taiwan's PCB maker Compeq Manufacturing is guardedly optimistic about its shipment prospects for the second half of the year, and will continue to diversify its target markets to...
Holtek
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research