The commercialization of 5G communication networks will spur the growth of both base station and smartphone markets, which in turn will significantly drive demand for high-performance...
Taiwan-based heat dissipation solution provider Forcecon Technology has introduced a new form of heat pipe, thermal ground plane (TGP), thickened 0.2mm for notebook and smartphone...
Apple has unveiled a new MacBook Pro featuring a 16-inch Retina Display, the latest 8-core processors, up to 64GB of memory, next-generation graphics with up to 8GB of VRAM and a...
Cooling fan maker Power Logic has seen orders for graphics cards pick up substantially in the second half of 2019, and expects the order pull-in momentum to carry on through 2020.
Cooling fan makers are looking forward to the business opportunities brought by autonomous driving and 5G developments with Sunonwealth Electric Machine Industry expecting demand...
Use of vapor chamber cooling modules for smartphones is set to expand significantly in 2020 as Samsung Electronics and Huawei are likely to have all of their 5G phones slated for...
Japan's Furukawa Electric and Taiwan-based Lemtech have teamed up to develop stainless steel-based ultra-thin vapor chamber cooling solutions for smartphones.
Taiwan-based notebook thermal solutions provider Anli International expects its deployments in non-notebook segments to bear fruit starting in the fourth quarter of 2019, when the...
Taiwan-based component makers, despite seeing shrinking demand for notebooks, have found new opportunities from emerging businesses such as foldable smartphones, foldable-screen notebooks...
Cooling module makers including Auras Technology, Chaun-Choung Technology (CCI) and Taisol Electronics are all moving to expand their capacities for vapor chambers (VCs) to cash in...
Taiwan-based cooling modules supplier Chaun-Choung Technology (CCI) has seen shipments for smartphones ramp up since the third quarter of 2019, expecting the revenue ratio for such...
Demand for vapor chambers (VCs) from smartphone vendors will grow exponentially in the next few years to support high heat-sinking performance required for 5G smartphones, according...
Samsung Electronics has taken the lead to adopt 0.35mm vapor chambers (VC) in its newly released Galaxy Note 10 series, which may become mainstream smartphone heat-sinking spec in...
Taiwan's cooling module suppliers are set for robust growth in 2020 and beyond driven by demand for heatpipe- or vapor chamber (VC)-based heat dissipation solutions from the smartphone...
With rising heat dissipation demand from major vendors including Samsung Electronics, LG Electronics, Huawei, Oppo and Xiaomi for their 5G smartphones, half of cooling module shipments...
