Silicon photonics (SiPh) has garnered significant business interest as a technology solution for high-speed data transfer in the era of AI. Currently, leading US chip manufacturers...
PCB manufacturer Zhen Ding Technology has experienced its second fire incident at its Guanyin site in Taoyuan, northern Taiwan, in five years. The origin of the fire and the precise...
Following trend towards miniaturization, IC manufacturers are under constant pressure to increase the density of interconnects, with the result that conductors with finer lines and...
Elephantech Inc., a Tokyo-based printed electronics manufacturer, has announced a breakthrough in developing general-purpose multilayer printed circuit boards (PCBs). The company's...
Following other PCB firms' expansion moves, niche copper-clad laminate (CCL) specialist Ventec announced plans in November for a production base in Thailand, which will begin volume...
Printed circuit board (PCB) and copper-clad laminate (CCL) manufacturers are positioning themselves to capitalize on the growing AI server demand to drive growth momentum in 2025.
AUO has said they are focusing on silicon photonics opportunities while holding onto its cautious approach panel-level fan-out packaging (FOPLP), a notable divergence from its rivals...
Generative AI requires ample resources, yet challenges such as limited high-quality data, rising freshwater and electricity consumption in data centers, and a widening copper supply...
Micro LED technology is emerging as a promising solution for high-speed AI data transmission and SiPh-based optical communication. Dr. David Su, Chief Strategy Officer of Ennostar,...
EMC, a leading manufacturer of environmentally friendly high-grade copper clad laminates (CCL), has announced its financial results for the third quarter of 2024. The company reported...
Innolux has gained attention for entering fan-out panel-level packaging (FOPLP). The Ministry of Environment recently commended the company for its resource recycling efforts, highlighting...
Applied Materials (Applied) has announced the use of a new material, ruthenium (Ru), in equipment designed to enhance efficiency in advanced semiconductor processes. This initiative...
Electroninks, the leader in metal-organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced the launch of the company's advanced...
Elite Material, a top manufacturer of high-performance copper clad laminates (CCL), has signed a strategic cooperation agreement with Zhen Ding, a global leader in PCB production...
Applied Materials introduced the industry's first use of ruthenium in high-volume production, enabling copper chip wiring to scale to the 2nm node and beyond while reducing resistance...
