Rising chip and copper prices are rapidly increasing cost pressure on LG Electronics.

TSMC is expanding cooperation with packaging and testing affiliate Xintec as it develops next-generation power delivery and advanced packaging...

AI data centers are approaching a physical limit: as scale-up architectures stretch across multiple racks and SerDes speeds near 448G,...

For years, the logic of AI infrastructure has been straightforward: move more data, push more power, transmit more signals, remove...