News tagged copper at DIGITIMES

NEWS TAGGED COPPER

Friday 10 April 2026

Merck's material and equipment push could speed CPO and advanced packaging adoption

Merck presented integrated materials and inspection tools at Touch Taiwan 2026 as the panel industry pivots toward chip-on-panel (CPO) and advanced packaging. The company emphasized...

Wednesday 8 April 2026

AI server boom lifts Taiwan's ACES Electronics into the high-speed interconnect race

As AI servers grow more complex and bandwidth demands surge, components once considered peripheral—connectors and high-speed cables—are emerging as critical determinants...

Tuesday 7 April 2026

Wonderful Hi-Tech bets on AI servers and satellites for next growth wave

After a slower second half of 2025, marked by elevated customer inventories and a softer ordering pace, high-end cable material provider...

Thursday 2 April 2026

Copper price surge drives quarterly lead frame price hikes

Lead frame packaging suppliers are hiking prices to pass along rising costs sweeping through the semiconductor supply chain. Gold, silver, and copper prices continue to climb sharply,...

Tuesday 24 March 2026

Nexperia turmoil accelerates localization; Panjit targets 5% global MOS market share

As mature process foundry prices rise, Panjit COO Edgar Chen said the company will not implement across-the-board price hikes despite increasing copper raw material costs. Instead,...

Friday 20 March 2026

MediaTek on cruise control as chipmakers scramble for next-gen silicon photonics standards

Nvidia GTC 2026 and the Optical Fiber Communication Conference (OFC) have underscored the growing importance of optical communication in cloud AI, with chipmakers playing an increasingly...

Wednesday 18 March 2026

Nvidia GTC 2026: Nvidia charts optical-copper path

At GTC 2026, Nvidia outlined a dual-track approach combining copper cables and silicon photonics (SiPh) to meet surging AI-driven demand for data center interconnects. CEO Jensen Huang...

Monday 16 March 2026

GEM Services upgrades copper clip bonding for AI server dual-sided cooling

Taiwan-based power semiconductor packaging and testing firm GEM Services has announced advancements in its copper clip bonding technology to meet growing demand for enhanced cooling...

Sunday 15 March 2026

PCB supply chains feel the heat of Middle East

The Middle East conflict is scorching more than just the region. Disrupted shipping lanes and tightening energy supplies are driving up costs across the printed circuit board (PCB)...

Tuesday 10 March 2026

Exclusive interview: Ayar Labs CEO Mark Wade says mass production capability remains a challenge for silicon photonics

US silicon photonics (SiPh) company Ayar Labs recently completed its Series E funding round. In addition to numerous capital firms participating, Taiwanese companies MediaTek and Alchip...

Sunday 8 March 2026

Broadcom CEO sees copper interconnects viable through 2028

Broadcom reported strong results for the first quarter of fiscal 2026, driven by robust demand for cloud application-specific integrated...

Friday 6 March 2026

Rising silver prices shift solar technology race toward low-silver cells

Rising global silver prices have pushed the cost of silver paste used in solar panels up about 2.5 times in six months, intensifying competition across the solar supply chain and accelerating...

Thursday 5 March 2026

Broadcom says Tomahawk switches are driving market share as AI networking demand accelerates

On March 4, Broadcom told investors its Tomahawk family is a key competitive advantage as customers build larger AI clusters. Management highlighted Tomahawk 6 — which it described...

Wednesday 4 March 2026

Commentary: Nvidia, MediaTek bankroll optics shift that's reshaping AI data centers

A new trend is emerging in the AI infrastructure race. After MediaTek invested in US silicon photonics start-up Ayar Labs, Nvidia followed with US$2 billion investments in optical...

Monday 2 March 2026

Commentary: Nvidia sparks silicon photonics race, yet copper still anchors data centers?

As data center computing demand expands, high-speed transmission architectures are under pressure to upgrade. Scaling high-performance computing platforms is exposing bandwidth and...

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Feb 9, 08:00

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

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Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook