Mon, Dec 6, 2021
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NEWS TAGGED CPE
Friday 24 September 2021
MediaTek urged to lead Taiwan mmWave 5G chips supply chain
Taiwan's makers of RF and PA devices hope MediaTek can lead the local supply chain to meet competition from Qualcomm in tapping the mmWave 5G market, according to industry sources...
Thursday 10 June 2021
IC analyzers sees booming demand for advanced foundry, packaging
Taiwan-based specialists in semiconductor materials analysis, IC test and verification services will see their sales for the second half of the year driven by continuous R&D on...
Monday 12 April 2021
Wi-Fi 6E chips to bring business for test, certification labs in 2H21
Chipmakers are set to roll out Wi-Fi 6E chip solutions in the second half of the year, bringing new business opportunities for IC test and certification labs including Sporton Inte...
Thursday 1 April 2021
Networking chips in extremely tight supply, says Unizyx
The supply chain of networking devices is experiencing the worst chip shortage in 30 years, heaping significant pressure on business operations of networking solutions providers,...
Friday 18 December 2020
Qualcomm executive identifies three major niche sectors for Taiwan supply chain in next decade
Taiwan supply chain players can enjoy lucrative business opportunities in three major sectors in the next decade of the 5G era, namely mmWave technology, 5G infrastructure equipment,...
Friday 23 October 2020
Expanding FWA services to spur 5G CPE demand, says Digitimes Research
A growing number of Taiwan-based network equipment suppliers have ramped up shipments of 5G CPE (customer premise equipment) products to the markets in Europe and the US starting...
Tuesday 15 September 2020
Quartz crystal maker TXC to build four new production lines in 1Q21
Taiwan-based quartz crystal components maker TXC has reported its monthly revenue surpassed NT$1 billion (US$34.2 million) for the first time in August 2020, and has disclosed plans...
Friday 4 September 2020
MediaTek intros new SoC for 5G CPE wireless devices
MediaTek has announced its T750 5G chipset designed to power next-generation 5G CPE wireless products, such as fixed wireless access routers (FWA) and mobile hotspots.
Thursday 28 May 2020
Kinsus gearing up to expand presence in FCBGA, AiP fields
Kinsus Interconnect Technology will strive to grow its business in the FCBGA and AiP packaging fields this year seeking to better cash in on new business opportunities arising from...
Wednesday 27 May 2020
Sporton busy fulfilling orders for inspecting 5G sub-6GHz chips, handsets
Taiwan-based Sporton International has been busy fulfilling orders from MediaTek for testing and certifying its 5G sub-6 GHz mobile SoCs as well as orders from Chinese handset vendors...
Tuesday 31 March 2020
Taiwan ODMs stay keen on expanding non-notebook sales
Taiwan's ODMs including Compal Electronics and Quanta Computer will continue to generate more revenues from non-notebook segments for further profit improvement in 2020 despite recent...
Friday 31 January 2020
5G fixed wireless broadband CPE market to reach nearly 7 million units in 2024, says ABI Research
As operators continue to roll out 5G networks, 5G fixed wireless broadband consumer premise equipment (CPE) shipments will hit more than two million units in 2020, and increase to...
Monday 2 December 2019
Small cell to have slower start in 5G, says Arcadyan president
The arrival of 5G commercialization will first boost smartphone demand, followed by customer premise equipment (CPE), with small cells to be the last to enjoy the benefits, according...
Thursday 28 November 2019
Winbond DRAM product series embracing the high demands of accelerated roll-out of 5G CPE modems and Image processing devices
The rise of the Internet of Things (IoT) creates the use cases from mobile devices to autonomous drones and from surveillance equipment to Advanced Driver-Assistance Systems (ADAS)...
Tuesday 17 September 2019
ASE gearing up for 5G mmWave AiP, RF modules assembling
Leading IC backend house ASE Technology Holding will have its fan-out (FO) packaging technology ready in 2020 at the earliest for volume production of mmWave antenna-in-package (AiP)...
Friday 10 February 2012
Macronix SLC NAND
Macronix International has announced its first single-level cell (SLC) NAND flash memory. Dubbed MX30LF, the new SLC NAND family is designed for code and data storage in a wide range of embedded applications including set-top boxes (STB), TVs, digital cameras, CPE and high-end networking devices, industrial PCs and automotive. Manufactured using Macronix's 75nm floating gate technology, the new MX30LF family comes with 512Mb and 1Gb of memory, according to the company. It has begun sampling the products with trial production scheduled for the first quarter of 2012.
Dec 3, 10:53
Enter the next phase of networking at a steady pace
Friday 3 December 2021
Impact of e-commerce, smart manufacturing on fashion industry
Friday 19 November 2021
Digitalizing textile supply chain
Friday 19 November 2021
Textile industry goes digital
TSMC enters pilot production of 3nm chips
OLED DDI supply may fall short of demand in 2022
Taiwan firms gearing up for upcoming Nvidia 5nm gaming GPUs
TSMC outsources part of CoWoS packaging production to OSATs
Samsung eyes reduced dependence on Qualcomm chips
US-Taiwan Economic Prosperity Partner Dialogue to connect Taiwan companies with US telecoms
Taiwan top-3 foundries poised to see combined revenues increase 25% in 2021
Digitimes Research worldwide notebook shipment update – October 2021
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