News tagged CXMT at DIGITIMES

NEWS TAGGED CXMT

Friday 2 January 2026

Samsung rolls out 7,200Mbps DDR5 samples as SK Hynix, CXMT intensify competition

Samsung Electronics has reportedly begun sampling next-generation DDR5 memory, delivering speeds that are approximately 30% faster than current mass-produced offerings. Industry observers...

Wednesday 31 December 2025

China's CXMT eyes US$4.2B Shanghai IPO to fuel memory chip expansion

China's leading domestic DRAM maker, ChangXin Memory Technologies (CXMT), is seeking to raise CNY29.5 billion (approx. US$4.2 billion)...

Tuesday 30 December 2025

SMIC acquires remaining stake in wafer unit for US$5.8 billion

Semiconductor Manufacturing International Corp. (SMIC), China's largest contract chipmaker, said on Monday it will take full control of its SMNC wafer manufacturing unit in a transaction...

Thursday 25 December 2025

South Korean prosecutors charge 10 individuals over alleged Samsung DRAM technology leak to CXMT

South Korean prosecutors have charged ten individuals over an alleged large-scale leak of 10nm-class DRAM process technology from Samsung Electronics to China's leading memory maker...

Monday 15 December 2025

SK Hynix reportedly eyes specialty DRAM manufacturing to fend off China memory surge

SK Hynix's rumored plan to enter low-power DRAM contract manufacturing for the first time is drawing industry attention, amid speculation that the move is driven by intensifying competition...

Thursday 4 December 2025

CXMT deepens DDR4 retrenchment; Nanya draws interest from US cloud giants

DDR4 DRAM supply remains severely constrained, with forecasts pointing to elevated pricing through the first half of 2026. Supply-chain sources say China-based CXMT will accelerate...

Monday 1 December 2025

CXMT narrows DRAM gap; market impact may be smaller than expected?

China's memory manufacturer CXMT, backed by government support, shifted to high-end technology development from 2025 and has introduced multiple next-generation DRAM products within...

Saturday 29 November 2025

CXMT's high-end DRAM push narrows China's gap with South Korea to one year

China's leading DRAM maker CXMT has unveiled new DDR5 and LPDDR5X chips with performance now viewed as comparable to Samsung Electronics and SK Hynix. The launch has unsettled South...

Tuesday 25 November 2025

CXMT's growth ceiling arrives early as US export restrictions tighten

China's semiconductor expansion is running into fresh obstacles as the US tightens export controls on advanced chipmaking tools. CXMT and other Chinese chipmakers are likely to face...

Tuesday 25 November 2025

Commentary: When CXMT stops following and starts defining the PC-server memory race

The global memory market is once again nearing an inflection point. With AI workloads spreading across end devices, DRAM has turned into the central bottleneck dictating shipment rhythms...

Tuesday 25 November 2025

YMTC rockets to 13% shipment share in NAND Flash, Micron now in sight

Yangtze Memory Technologies Corp (YMTC) has strengthened its position in the global NAND Flash market, exceeding a 10% shipment share in the first quarter of 2025 and rising to 13%...

Monday 24 November 2025

DDR5 breakthrough: CXMT showcases 8000Mbps memory at IC China 2025

China's memory maker CXMT used this year's IC China 2025 expo to debut its new DDR5 product line, signalling its most assertive push...

Thursday 20 November 2025

A DRAM crunch, MediaTek's hunt in Korea, and a surprise player in China's memory rebound

The global memory market is experiencing a severe shortage, with NAND and DRAM prices skyrocketing. Smartphone, PC, industrial PC, and automotive vendors are racing to secure inventory...

Wednesday 12 November 2025

CXMT and Tesla's chip plans challenge South Korea's semiconductor lead

South Korea's semiconductor industry, boosted by AI-driven HBM memory demand, faces challenges as China's CXMT speeds up HBM3 production and Tesla plans to create its own wafer fab...

Friday 7 November 2025

CXMT adopts SK Hynix's MR-MUF tech to close China's HBM gap by 2026

China's DRAM maker CXMT plans to start mass production of fourth-generation high-bandwidth memory (HBM3) in 2026 using mass reflow molded underfill (MR-MUF) packaging, the same technology...

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iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook