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Wednesday 16 July 2025
South Korea faces urgent challenges as the US and China advance in autonomous driving

With the US and China rapidly advancing in autonomous vehicle (AV) technology and aggressively expanding their global footprint, South...

Wednesday 16 July 2025
Meta doubled down on AI infrastructure, Foxconn, Taiwan supply chain ride the cocktail
Meta is turbocharging its bet on artificial intelligence, with CEO Mark Zuckerberg revealing plans to invest hundreds of billions of dollars in building large-scale AI infrastructure...
Wednesday 16 July 2025
Trump hails US$92 billion in investments for AI, energy projects
President Donald Trump hailed more than US$92 billion in investments in artificial intelligence and energy infrastructure during a visit to Pennsylvania, highlighting his efforts...
Tuesday 15 July 2025
Taiwan's e-commerce platforms struggle while service providers thrive
Taiwan's leading e-commerce platforms have been struggling amid the fading post-pandemic boom and heightening competition, with market leader Fubon Multimedia (under the Momo brand)...
Tuesday 15 July 2025
AI boom is transforming data centers & pushing energy limits
There is no question that AI and cloud computing have been rapidly revolutionizing the technology landscape. From capacity expansion and energy pressure to cooling innovations, data...
Tuesday 15 July 2025
Meta's AI ambitions go gigawatt-scale in race for superintelligence

Meta Chief Executive Mark Zuckerberg announced plans to invest hundreds of billions of dollars over the next several years to build a...

Tuesday 15 July 2025
China's PIM chip sidesteps HBM restrictions, advanced node barriers
China remains at a disadvantage in high-bandwidth memory (HBM) and other advanced chip technologies, with sanctions on cutting-edge process nodes further delaying domestic semiconductor...
Tuesday 15 July 2025
GUC tapes out industry-leading UCIe face-up IP for TSMC SoIC-X
Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful tape-out of the industry-leading Universal Chiplet Interconnect Express (UCIe) PHY Face-Up IP...
Monday 14 July 2025
Tariffs bite: China–US trade drops 9% in 1H as chip imports, rare earth exports climb

China–US trade fell 9.3% year-over-year in the first half of 2025, totaling CNY2.08 trillion (approx. US$290 billion), according...

Monday 14 July 2025
Industry calls for delay as EU's AI crackdown begins
The EU has released the Code of Practice ("Code") for General-Purpose AI Models (GPAI), a preparatory measure for the AI Act set to take effect on August 2, 2025. The Code aims to...
Monday 14 July 2025
Taiwan must move beyond OEM/ODM to export complete systems, particularly aging-related technology, says NSTC Minister
Taiwan must move beyond its traditional OEM (original equipment manufacturing) and ODM (original design manufacturing) model and focus on exporting complete systems, particularly...
Monday 14 July 2025
Cisco drives AIoT proof of concept from point to area, aims to extend Asia New Bay Area experience to semiconductor industry
As AIoT technology deepens its application across industrial sectors, networking and cybersecurity brand Cisco has partnered with Genesis to launch the "AIoT Sustainable Innovation...
Monday 14 July 2025
South Korea advances self-driving commuter bus with risk prediction model
South Korea's autonomous driving technology has entered the proof of concept stage. Their PanTa-G self-driving bus operates in Pangyo and has so far served over 55,000 passengers...
Monday 14 July 2025
Huawei’s HiSilicon debuts low-power Cat.1 chip to boost IoT reach
On July 10, 2024, Huawei's chip subsidiary HiSilicon launched its first Cat.1 IoT communication chip — the Hi2131 — officially entering the fast-growing cellular IoT market,...
Monday 14 July 2025
JEDEC's LPDDR6 sets new pace for mobile and AI memory with faster, leaner architecture
On July 9, 2025, the JEDEC Solid State Technology Association, the leading organization for microelectronics standards, introduced LPDDR6 (JESD209-6), its latest low-power DRAM specification...