As inventory levels normalize and artificial intelligence (AI) applications continue to expand in the market, Nexcom chairman Clement Lin expressed confidence that their accumulated...
The emergence of DeepSeek as a transformative force in edge AI development has supply chain operators anticipating a new wave of consumer upgrades across smart devices, from smartphones...
The emergence of DeepSeek has demonstrated that edge artificial intelligence (AI) development can proceed without high-performance graphics processing units (GPUs), spurring increased...
Surging demand for artificial intelligence (AI) is pushing TSMC to expand its advanced packaging capacity. As a key testing partner, Xintec—a TSMC-affiliated outsourced semiconductor...
The Chinese computing power market has experienced significant growth following the debut of DeepSeek R1. According to market sources, the end of the Lunar New Year holidays has increased...
AZAPA, a Japanese automotive development and design startup, is set to launch its semi-solid-state battery system by 2025, primarily aimed at electric vehicles (EVs) technology. This...
Kaynes SemiCon is strengthening its position in the outsourced semiconductor assembly and test (OSAT) market, moving closer to securing new customers from Japan and the US as part...
Xintec, a TSMC-affiliated semiconductor packaging house, anticipates that increased geopolitical uncertainties, declining market demand, and shifts in customer-supplier strategies...
The increasing adoption of application-specific integrated circuits (ASICs) for artificial intelligence (AI) has sparked discussions about potential competition to Nvidia's GPU market...
Apple is ramping up efforts to develop its own wireless connectivity chips, signaling a shift away from suppliers. The company is advancing in modem, Wi-Fi, and RF chip development,...
The global automotive industry is undergoing another wave of restructuring, with the trend of modular platforms gaining momentum. In response, Gogoro is set to implement strategies...
Nikon plans to introduce a new ArF immersion lithography system platform in fiscal year 2028 (April 2028 - March 2029) that offers compatibility with ASML equipment, marking a strategic...
Recent market rumors suggest that Arm is entering the chip development battleground, with Meta's cloud computing chip as its first product. Many are concerned that this indicates...
SK Hynix has reportedly appointed Vice President Woong-sun (William) Lee to head its newly established semiconductor packaging facility in the US. His leadership will be closely watched...
Mark Liu, the former executive chairman of Taiwan Semiconductor Manufacturing Company (TSMC), is spearheading a bold initiative to enhance American technology leadership. According...
