Samsung Electronics has announced that it will provide turnkey semiconductor solutions using the 2-nanometer (nm) foundry process and the advanced 2.5D packaging technology Interposer-Cube...
Samsung Electronics Chairman Lee Jae-yong recently met with Vietnamese Prime Minister Pham Minh Chinh, discussing plans to expand investments in Vietnam.
The rapid development of large language models (LLMs) in China has led to various development bottlenecks for AI, including complex computing power management, high training and inference...
Acer has received positive feedback from channel retailers for its AI PCs and expects its core operations in the second half of the year to outperform the first half. On July 8, the...
While Japanese manufacturers have long been at the forefront of bipedal humanoid robot development, recent AI breakthroughs from the US and China's IT industry have propelled these...
Vietnam's cautious approach to offering investment incentives may have cost the country billions of dollars in potential economic benefits and development. According to reports from...
Under the guidance of newly appointed head Young Hyun-Jun, Samsung Electronics' Semiconductor and Device Solutions (DS) division is reportedly enhancing its competitiveness in high-bandwidth...
Innolux Corporation, a leading display panel manufacturer, is undergoing a significant transformation as it ventures into the semiconductor field with its Fan-Out Panel Level Packaging...
To concentrate more on its AI chip business, Samsung Electronics has reportedly decided to adjust the development pace of its "Exynos Auto" automotive chip project, which has been...
Indian semiconductor startup Silizium Circuits is a promising company receiving support from the Taiwan government and stationed at the Tainan site of Taiwan Tech Arena (TTA-South),...
Glass core substrates (GCS) are poised to play a crucial role in next-generation advanced chip packaging. In response, Japanese and South Korean semiconductor supply chain players...
