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Thursday 25 July 2024
Power crunch casts clouds over South Korea's largest chip cluster in Yongin
Samsung and SK Hynix plan to invest KRW360 trillion (US$259.2 billion) and KRW120 trillion, respectively, to build 10 semiconductor fabs in Yongin, South Korea, making it the world's...
Thursday 25 July 2024
Vietnam works with Qorvo, Cadence to train 50,000 engineers by 2030
US-based semiconductor solutions provider Qorvo has partnered with electronic design automation software and engineering services supplier Cadence Design Systems to help Vietnam boost...
Thursday 25 July 2024
Tesla profit drop in 2Q24 highlights transformation challenges
Tesla's net profit fell by 45% YoY in the second quarter of 2024 to US$1.48 billion, which may indicate that the company is facing challenges with its transformation, according to...
Wednesday 24 July 2024
Tenstorrent aims to challenge Nvidia with low-priced AI processor based on RISC-V
AI startup Tenstorrent, led by chip industry veteran Jim Keller as CEO, recently announced a new generation of AI hardware featuring the Wormhole Tensix processor equipped with RISC-V...
Wednesday 24 July 2024
IC packaging will be more important than foundry, says YMTC chairman
Chen Nanxiang, chairman of Chinese memory company Yangtze Memory Technology Corp (YMTC), recently said during an interview with China Global Television Network (CGTN) that he expects...
Wednesday 24 July 2024
Taiwan offshore wind industry faces delays, shifts focus to Japan and Korea
Taiwan's offshore wind power industry, once heralded as a cornerstone of the country's green energy transition, is now grappling with significant challenges. Policy shifts and supply...
Wednesday 24 July 2024
Taiwan Digital Affairs Minister outlines comprehensive AI strategy at AWS Summit
Promoting the development of the artificial intelligence (AI) industry is one of Taiwan's key priorities, according to Yennun Huang, Minister of Digital Affairs. Relevant measures...
Wednesday 24 July 2024
PTI engaged in FOPLP, seeking collaboration
Powertech Technology (PTI) is currently developing fan-out panel-level packaging (FOPLP) and seeking collaboration with fabless chip vendors, according to the Taiwan-based memory...
Wednesday 24 July 2024
Poor results from NXP raise doubt on 2H24 car chip demand
Disappointing results from NXP Semiconductors in its latest financial report may indicate that car manufacturers are becoming more conservative and the development of battery electric...
Tuesday 23 July 2024
IC industry hopes for turnaround in 2H24 amid new AI PC solutions
When will AI PC dividends start to pay off for the chip industry? This question has been closely followed by many in the industry during the first half of 2024. The launch of Copilot+PC,...
Tuesday 23 July 2024
Apple's rumored foldable iPhone yields mixed news for Samsung
Recent rumors suggest that Apple is conducting research and development for its first "foldable iPhone," with a potential release targeted for 2026. Industry sources believe that...
Tuesday 23 July 2024
Composite materials balance high potential with high costs
Composite materials are gaining significant momentum across various industries, particularly in aerospace, automotive, and offshore wind energy sectors. Renowned for their high strength,...
Tuesday 23 July 2024
Huawei, MediaTek likely to settle patent dispute out of court
Huawei's patent infringement lawsuit against MediaTek is likely a move to gain bargaining chips in licensing fee negotiations between the two sides, according to industry sources.
Monday 22 July 2024
Taiwan prioritizes drones and AI in new defense technology unit
Taiwan has established a new Defense Innovation Unit (DIU) to accelerate the integration of drones and Artificial Intelligence (AI) systems into its military strategy. This unit,...
Monday 22 July 2024
ThinTech eyes advanced packaging opportunities
ThinTech Materials Technology (ThinTech) anticipates stronger performance in the second half of 2024, buoyed by warming demand for panels and the successful development of Fan-Out...