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Tuesday 5 July 2022
IC design houses brace for weak 3Q22
IC design houses are bracing for a particularly weak third-quarter 2022 while also having difficulty negotiating lower foundry quotes, according to industry sources in Taiwan.
Tuesday 5 July 2022
Taiwan pure-play foundries stay firm on prices
Taiwan-based pure-play foundries intend to stay firm on prices, despite a cutback in orders for display driver ICs and other consumer chips, according to industry sources.
Wednesday 29 June 2022
TCL eyes India smart TV market with locally-made display panels
Backed by TCL CSOT's India plant, TCL has launched three smart TVs in India, in a bid to become the leader of the fast-growing market segment and to export products overseas in the...
Wednesday 29 June 2022
Taiwan panel makers face another hit from rising electricity costs
Taiwan-based panel makers, which have been strapped by falling panel prices and waning demand, will bear the brunt of planned electricity rate hikes starting July, according to industry...
Tuesday 28 June 2022
DDI prices to fall further in 2H22
Display driver IC prices are poised to continue their slide in the second half of 2022 amid reducing demand, particularly from the panel sector, according to industry sources.
Friday 24 June 2022
Samsung Display to reportedly supply car-use OLED panels for BMW
Samsung Display (SDC) will reportedly supply OLED panels used in automotive displays for BMW, according to South Korea-based ETNews.
Tuesday 21 June 2022
Large-size DDI demand unlikely to rebound until end-2022
Large-size display driver ICs (DDI) demand is unlikely to pick up until the end of 2022, as continuous inventory adjustments at clients and production reductions by panel makers are...
Tuesday 21 June 2022
Taiwan foundries to see fab utilization rates stay above 90% in 2H22
TSMC and other major Taiwan-based foundries have been running their fabs at full capacity utilization, but may see their fab utilization rates drop in the third quarter due to cutbacks...
Tuesday 21 June 2022
IC design houses cut wafer starts at foundries for 3Q22
Many IC design houses, particularly those engaged in the consumer electronics sector, have moved to adjust their wafer starts at foundries amid concerns about a potentially weak third...
Friday 17 June 2022
Taiwan DDI suppliers eye OLED DDI orders from Samsung
More Taiwan-based display driver IC suppliers are expected to obtain OLED DDI orders from Samsung Electronics in 2023, as the Korea-based vendor's supply shortfall will worsen, according...
Wednesday 15 June 2022
Samsung Display to end 30-year production of TV-use LCD panels
Samsung Display (SDC) will terminate production of TV-use LCD panels at its L8-2 factory at the end of June 2022, according to South Korea-based Yonhap News Agency and Maeil Business...
Friday 10 June 2022
Samsung Display reportedly hikes yield rates for large-size QD-OLED panels to 80%
Samsung Display (SDC) has hiked yield rates for large-size QD-OLED panels from 30% initially, 50% in 2021, 75% in April-May 2022 to 80% currently, according to South Korea-based The...
Friday 10 June 2022
Novatek remains upbeat about OLED DDI demand
Despite concerns that the OLED display driver IC (DDI) market may be hit by disappointing smartphone sales, Novatek Microelectronics vice chairman Steve Wang said the company remains...
Thursday 9 June 2022
Novatek steps up product diversification
Display driver IC specialist Novatek Microelectronics has stepped up its product diversification efforts, looking to expand beyond its core DDI business, according to company vice...
Wednesday 1 June 2022
DDI suppliers to place more orders with 12-inch foundries
Display driver IC suppliers have made slight adjustments in their wafer sourcing strategies between the end of 2022 and 2023 by placing more orders with 12-inch foundries, according...
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.