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Wednesday 16 June 2021
IC Insights raises 2021 IC market forecast to 24% growth
IC Insights has raised its IC market growth forecast for 2021 to 24%, compared with its previous estimate of 19% growth.
Wednesday 16 June 2021
Shortage of notebook ICs in varying degrees
Shortages of notebook-use ICs are in varying degrees, according to industry sources. The supply of display driver ICs, power management chips and I/O controllers is extremely tight,...
Tuesday 15 June 2021
PSMC negotiating orders for 2023
Taiwan-based pure-play foundry Powerchip Semiconductor Manufacturing (PSMC) continue to see orders demanding 8- and 12-inch wafer fabrication services pull in, and is in talks with...
Thursday 10 June 2021
Macroblock's mini-LED backlight driver ICs raise display performance of LCD
Consumer demand for higher audiovisual quality is driving the evolution of technologies behind LCD displays. Specifically, mini-LEDs, with their superior contrast and color gradation...
Wednesday 9 June 2021
Supply chain gearing up shipments for new MacBook Pro
Apple is expected to roll out two new MacBook Pro models later in 2021, with shipments slated to kick off in the third quarter, according to industry sources.
Wednesday 9 June 2021
Wah Hong stepping up niche-product developments
Optoelectronic materials supplier Wah Hong Industrial is gearing up for niche-product developments, focusing on protective films for 5G devices, optoelectronic materials for mini/microLED...
Wednesday 9 June 2021
HannStar Display revenues more than double in May
HannStar Display, which makes mainly small- to medium-size LCD panels, saw its May revenues jump 123% on year to NT$2.82 billion (US$101.52 million). The figures were also up 2.3%...
Monday 7 June 2021
Samsung to see non-memory chip sales boom in 2021
Samsung Electronics is expected to see sales of its non-memory business particularly the system LSI segment boom this year, buoyed by strong demand for handset application processors,...
Friday 4 June 2021
HannStar to start rolling out LPRD panels
HannStar Display will start rolling out LPRD (low power reflective display) panels in 2021, targeting applications for smart retailing, education, transportation, fitness, and environmental...
Wednesday 2 June 2021
Acer adopts AUO AmLED display in new gaming notebook
Acer has demonstrated its new-generation gaming notebook series featuring AUO's miniLED display technology.
Wednesday 26 May 2021
Global 200mm fab capacity to grow at record pace, says SEMI
Semiconductor manufacturers worldwide are on track to boost 200mm fab capacity by 950,000 wafers, or 17%, from 2020 through 2024 to reach a record high of 6.6 million wafers per month,...
Wednesday 26 May 2021
Apple to outpace Samsung as top buyer of smartphone AMOLED displays
Apple is expected to unseat Samsung Electronics as the largest buyer of AMOLED displays for smartphones in 2021, as new iPhones for the year reportedly will all adopt flexible AMOLED...
Tuesday 25 May 2021
GIS upbeat about fingerprint sensor modules for 2021
Touch module provider General Interface Solution (GIS) has expressed optimism about shipment momentum for 2021, driven by growing demand for ultrasonic fingerprint sensing modules...
Monday 24 May 2021
OSATs may further hike service quotes in 3Q21
Taiwan OASTs are expected to enforce a new round of quote hikes in the third quarter of the year to reflect ever-rising prices for raw materials particularly for QFN wire-bonding...
Friday 21 May 2021
OSE to expand EMS services, boost partnership with Chipbond
Orient Semiconductor Electronics (OSE) is looking to scale up its EMS business beyond the electronics sector, while strengthening its collaboration with backend house Chipbond Technology...
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.