Packaging and testing house International Semiconductor Technology (IST) has seen its utilization rate drop significantly because of weak demand from driver IC clients. The company...
Packaging and testing company ChipMOS Technologies has announced a downward adjustment in its third-quarter guidance to reflect the reduction in DRAM production and inventory adjustment...
Handset makers are preparing to launch more models for the second half of the year than in the first half, thanks to recovering demand, but the outlook for shipment volumes is still...
The recent large-size panel price drops are causing makers to heap more pressure on upstream component makers for additional cost downs. Component suppliers are at a disadvantage...
Chipbond Technology is facing stronger resistance from clients to its planned increases in driver IC packaging and testing quotes, as the LCD panel market is turning more conservative...
NEC Electronics and Elpida Memory have announced they have agreed to form a joint venture in the field of display driver ICs. The basic agreement is the result of an alignment of...
LCD driver IC design houses are expected to have only a mild sequential sales growth, or decline, in May as demand for small- and medium-size panels is weak.
