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NEWS TAGGED E-BEAM
Friday 20 December 2013
Inspection tool maker HMI to post another record sales quarter
Revenues at Hermes Microvision (HMI), which provides electron beam (e-beam) inspection tools and solutions for the production of semiconductors, are set to hit a record high for the...
Wednesday 4 December 2013
Hermes Microvision shipping e-beam inspection tools for 1Xnm processes
E-beam inspection tool supplier Hermes Microvision (HMI) has begun shipping its eScan 500-series inspection tools for 1Xnm processes, which help ramp up its revenues in 2014, according...
Monday 4 November 2013
Inspection tool maker HMI posts high EPS in first 3 quarters of 2013
Hermes Microvision (HMI), which provides electron beam (e-beam) inspection tools and solutions for the production of semiconductors, has reported an EPS of NT$8.41 (US$0.29) for the...
Monday 7 October 2013
Inspection tool maker HMI posts record September, 3Q13 revenues
Hermes Microvision (HMI), which provides electron beam (e-beam) inspection tools and solutions for the production of semiconductors, has reported record consolidated revenues for...
Thursday 22 August 2013
KLA-Tencor to set up equipment training center in Taiwan
Semiconductor equipment maker KLA-Tencor has announced plans to invest a total of US$3 million to set up a local equipment training center in Taiwan slated for completion in April...
Monday 8 July 2013
Inspection tool maker HMI posts record 2Q13 revenues
Hermes Microvision (HMI), which provides electron beam (e-beam) inspection tools and solutions for the production of semiconductors, saw its second-quarter revenues hit a record high...
Wednesday 30 January 2013
KLA-Tencor intros new e-beam inspection system
KLA-Tencor has announced a new electron-beam inspection system, the eS805, which is already shipped to leading logic and chip manufacturers.
Thursday 27 December 2012
Inspection tool supplier HMI reportedly secures orders from Intel
E-beam inspection equipment supplier Hermes Microvision (HIM) has secured orders from Intel, according to industry sources. With the addition of new orders placed by a world leading...
Monday 10 September 2012
Hermes Microvision posts 80% rise in Jan-Aug revenues
Inspection tool supplier Hermes Microvision (HMI) has announced that revenues for the first eight months of 2012 climbed 79.5% from a year ago to NT$2.7 billion (US$90.9 million).
Tuesday 16 August 2011
New KLA-Tencor e-beam tool to accelerate defect sourcing for 20nm nodes and below
KLA-Tencor has announced a new tool for chip manufacturing at the 20nm device nodes and below: the eDR-7000 electron-beam (e-beam) wafer defect review system.
Thursday 21 October 2010
EUV to get ready for high-volume production in 2014, says IMEC chief
Extreme ultraviolet (EUV) lithography is likely to reach mass production in 2014 at the earliest, according to Luc Van den hove, president and CEO of Belgian researcher IMEC. But...
Wednesday 24 February 2010
More industry leaders push e-beam technology
Globalfoundries, Jeol, KLA-Tencor, NuFlare Technology, Petersen Advanced Lithography and Samsung Electronics have joined the eBeam Initiative - a forum dedicated to the education...
Monday 6 July 2009
TSMC joins CEA-Leti program on multiple e-beam lithography
Taiwan Semiconductor Manufacturing Company (TSMC) has announced it will join a three-year program led by the CEA-Leti research institute on electron-beam (e-beam) maskless lithography...
Monday 18 May 2009
TSMC sees delay in e-beam equipment delivery
Taiwan Semiconductor Manufacturing Company (TSMC) has seen a delay in the delivery of 300mm multiple electron-beam (e-beam) maskless lithography equipment from Mapper Lithography...
Thursday 23 April 2009
TSMC beefs up R&D, moving to 22nm by 2011
Taiwan Semiconductor Manufacturing Company (TSMC) has said it is on track to increase manpower within its R&D and design service units by 30% and 15%, respectively, while proceeding...
Colder Products Company
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research