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Tuesday 1 October 2024
SK Hynix's debut at TSMC OIP forum showcases HBM3E, H200 breakthrough, boosts Nvidia partnership
SK Hynix recently spotlighted its high-bandwidth memory (HBM) technologies with great emphasis on its collaboration with Nvidia during its participation in TSMC's Open Innovation...
Tuesday 1 October 2024
Fujifilm doubles down on materials for sub-2nm process nodes
Fujifilm plans to strengthen its semiconductor materials capabilities with an investment of JPY 20 billion (US$ 140 million) to build facilities in Shizuoka and Oita, focusing on...
Tuesday 1 October 2024
Taiwan's CHEM targets US, Japan as global energy demand rises
Chung-Hsin Electric and Machinery Manufacturing (CHEM) is witnessing substantial growth driven by aggressive capacity expansion, having acquired multiple factories to boost production...
Tuesday 1 October 2024
Global 300mm fab equipment spending to hit US$400 billion from 2025 to 2027, says SEMI
Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, according to SEMI. The robust spending is being driven by the regionalization...
Tuesday 1 October 2024
How China is accelerating advanced packaging with HBM and CoWoS amid tightening US restrictions
Presently, the enhancement of AI chips' computing power heavily depends on advanced packaging technologies such as CoWoS and HBM, with the two technologies complementing each other...
Tuesday 1 October 2024
BYD's local integration drives ASEAN market dominance
The ASEAN market, spanning multiple countries, has become a fiercely competitive battleground for numerous automotive and new energy vehicle (NEV) brands. In this landscape, BYD has...
Tuesday 1 October 2024
Concerns grow over global DDI supply security after US lawmakers target Chinese panel manufacturers
Following recent geopolitical tensions, concerns regarding the supply chain security of technology products have intensified globally. The United States has expressed intentions to...
Tuesday 1 October 2024
SK Hynix advances 16-layer HBM3E to maintain market lead
SK Hynix is expediting the development of 16-layer HBM3E (High Bandwidth Memory) to reinforce its leading position in the competitive HBM market, as challenges from rivals like Samsung...
Tuesday 1 October 2024
Samsung delays Taylor and Pyeongtaek fab construction amid global semiconductor slowdown
Samsung Electronics has reportedly delayed construction and equipment orders for its Pyeongtaek Phase 4 (P4) plant in South Korea and its second facility (T2) in Taylor, Texas. This...
Tuesday 1 October 2024
Venture capitalist joins Unisoc board
A Chinese venture capital heavyweight Datong Chen has been appointed to the board of directors of China-based IC design company Unisoc. Chen, chairman of Investment Committee, Hua...
Tuesday 1 October 2024
TCL CSOT buys LGD Guangzhou site, strengthening China's TV panel dominance
LG Display (LGD) and TCL China Star Optoelectronics Technology (TCL CSOT) have signed an agreement for the latter to buy LGD's 8.5G LCD facility in Guangzhou for CNY10.8 billion (US$1.54...
Tuesday 1 October 2024
MCU firms cautious about 4Q24 prospects
Taiwan-based MCU firms generally remain cautious about their sales prospects for the fourth quarter of 2024, primarily due to the slow recovery in demand in China, according to industry...
Tuesday 1 October 2024
China enacts subsidies to stimulate TV demand
The subsidy program implemented by the Chinese government to encourage domestic consumers to replace old TVs with new ones is anticipated to stimulate overall TV demand in the fourth...
Monday 30 September 2024
South Korea's chip stockpiles shrink at fastest pace since 2009
South Korea's semiconductor stockpiles dwindled at the fastest clip since 2009 last month in a sign of sustained demand for high-performance memory chips used in artificial intelligence...
Monday 30 September 2024
China urges local companies to stay away from Nvidia's chips
Beijing is stepping up pressure on Chinese companies to buy locally produced artificial intelligence chips instead of Nvidia Corp. products, part of the nation's effort to expand...
Colder Products Company
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research