The 2024 World Artificial Intelligence Conference (WAIC) opened in Shanghai, showcasing an impressive array of 45 intelligent robots, including 25 humanoids.
Yoke Technology, a China-based semiconductor and chemical material supplier, has disclosed its preliminary financial results for the first half of 2024. The company expects a net...
Robin Li, Chairman and CEO of Baidu has not minced words regarding the over-proliferation of AI models in China, lambasted the " war of a hundred models" as a substantial waste of...
The prospect of South Korean battery maker SK On returning to profitability anytime soon looks dim, judging from the uncertainty in the market, according to industry sources.
Beijing will support the introduction of robotaxis in ride-hailing and car rental fleets in the city as advanced driver assistance systems become more commonplace in China.
Honda Motor Co. will consolidate its two car plants in Thailand by 2025 to deal with overcapacity and focus resources on electrification as battery electric vehicles gain popularity...
A new semiconductor back-end process R&D alliance, US-JOINT, is set to launch in Silicon Valley in 2025. The alliance will focus on next-generation semiconductor packaging technologies...
Samsung Electronics has announced that it will provide turnkey semiconductor solutions using the 2-nanometer (nm) foundry process and the advanced 2.5D packaging technology Interposer-Cube...
The Japanese government's intellectual property export strategy, known as the "Cool Japan" strategy, proposed its latest amendment in 2024. It identified translation as the primary...
The European Union's temporary tariff on Chinese electric vehicles (EVs) kicked in on the 5th, sparking varied reactions among automakers. Despite initial assurances from Chinese...
The keen competition of large-language models (LLMs) is pushing various Generative AI operators in China to find alternatives to achieve higher computing power without...
SoftBank offered to acquire Graphcore, which designs AI chips for data centers, for US$500 million. The deal is subject to review by the UK, while SoftBank's massive stake in Arm...
The rapid development of large language models (LLMs) in China has led to various development bottlenecks for AI, including complex computing power management, high training and inference...
Samsung Electronics is reportedly developing a new packaging technology to address the overheating of mobile application processors (APs), which may be applied to its next-generation...
