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NEWS TAGGED FC CSP
Tuesday 9 July 2013
High-end packaging next battlefield for IC assembly and test services providers, says Amkor executive
Robust growth in smartphone usage is encouraging semiconductor assembly and test services providers to head towards related packaging technologies. Amkor Technology is already among...
Tuesday 18 June 2013
NPC 2013 capex to focus on FC CSP substrates, says president
Nan Ya PCB (NPC) will invest most of its targeted capex of NT$2 billion (US$67 million) on FC CSP (chip scale package) substrates in 2013, acknowledging brisk demand coming from the...
Monday 17 June 2013
SPIL expanding capacity for high-end ICs
Siliconware Precision Industries (SPIL) has moved to expand production capacity at a fast pace for high-end IC packaging and testing in anticipation of robust demand for mobile communication...
Monday 7 January 2013
Kinsus to perform strongly in 1Q13 on steady demand for FC CSP substrates
Kinsus Interconnect Technology will perform relatively strongly in the first quarter of 2013, buoyed by shipments of FC CSP (flip-chip chip-scale package) substrates to clients including...
Tuesday 20 November 2012
STATS ChipPAC to expand operations in Korea
STATS ChipPAC has announced plans to expand its semiconductor assembly and test operation in South Korea. The Singapore-based backend house added that it has signed a non-binding...
Thursday 4 October 2012
FC CSP substrate supply may be affected by explosion at Nippon Shokubai
The supply of a chemical raw materials for producing ink used in the production of FC CSP (flip chip-chip scale package) substrates may be affected after a recent explosion and fire...
Thursday 20 September 2012
Kinsus looks to increasing shipments of FC CSP substrates in 4Q12
Kinsus Interconnect Technology has entered the supply chain of Apple's iPhone 5 and is expected to see robust shipments of its FC CSP (chip scale package) substrates for Qualcomm's...
Wednesday 8 February 2012
Kinsus nets NT$6.28 per share in 2011
IC substrate supplier Kinsus Interconnect Technology has announced NT$2.8 billion (US$94.9 million) in net profits and an EPS of NT$6.28 for 2011. The firm's board of directors decided...
Tuesday 29 November 2011
Copper pillar bump penetration of FC packaging to rise
Adoption of copper pillar bump for flip-chip (FC) packaging is expected to increase, with its proportion rising from 10-20% in 2010-2011 to 20-30% in 2015, industry sources quoted...
Tuesday 4 October 2011
Kinsus ramping up FC CSP substrate shipments for Apple A5 CPUs, says paper
Shipments of flip-chip chip-scale package (FC CSP) substrates for Apple's A5 processors from Taiwan-based Kinsus Interconnect Technology are expected to top one million units a month...
Friday 9 September 2011
Unimicron lands orders from TI and Apple, says paper
Unimicron Technology will soon begin to ship its FC CSP (flip-chip chip-scale-packaging) substrates to Texas Instruments (TI) for the production of ARM-based OMAP3 CPU lineups, according...
Thursday 11 August 2011
Kinsus announces strong sales for July
IC substrate maker Kinsus Interconnect Technology has announced revenues of NT$1.48 billion (US$50.95 million) for July, up 5.5% sequentially and 8.3% on year, according to a company...
Wednesday 27 July 2011
Kinsus posts EPS over NT$3 in 1H11, says paper
IC substrate maker Kinsus Interconnect Technology has reported net profits of NT$1.41 billion (US$48.91 million) for the first half of 2011, which translated into an EPS of NT$3.16...
Wednesday 20 July 2011
Strong growth for semiconductor equipment in advanced packaging market, says Information Network
Advanced packaging is currently growing at a 18% compound annual rate, and equipment manufacturers will be major beneficiaries, according to market research firm The Information Ne...
Tuesday 17 May 2011
Kinsus lands FC CSP substrate orders from Intel, says paper
IC substrate maker Kinsus Interconnect Technology has landed orders for FC CSP (flip-chip chip-scale packaging) substrates from Intel, according to a Chinese-language Commercial...