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Grand Opening of Wolfspeed Mohawk Valley 200mm SiC Fab
Global EV sales and battery capacity
May 20, 17:56
NEWS TAGGED FINFET
Monday 16 May 2022
SMIC no longer discloses revenue by process nodes
China-based pure-play foundry Semiconductor Manufacturing International (SMIC) has reported first-quater 2022 sales, but omitted a revenue breakdown by manufacturing process nodes...
Friday 29 April 2022
MA-tek enjoys robust chip analysis orders for advanced processes
IC analysis and certification lab Material Analysis Technology (MA-tek) continues to enjoy a rapid rise in analysis demand for sub-7nm chips, particularly 3/2nm process now under...
Friday 22 April 2022
TSMC sets timetable to commercialize 2nm GAA process in 2025
TSMC has set a timetable to move its 2nm GAA process to production in 2025 while commercializing its 3nm FinFET process with improved yield rates in the second half of 2022, with...
Thursday 21 April 2022
Samsung hits snag in 3nm process, yet posing new challenges to TSMC
Poor 3nm GAA process yield performance is deemed as a major setback for Samsung Electronics in its advanced foundry technology race with TSMC, which may dash the Korean tech giant's...
Tuesday 19 April 2022
China making slow progress towards chip self-sufficiency
In addition to trade restrictions imposed by the US on crucial equipment, the ongoing COVID lockdowns in China's production hubs in Shanghai and other cities are disrupting the country's...
Monday 18 April 2022
Samsung 3nm GAA process yield still far behind target
Samsung Electronics' 3nm GAA process yield rates reportedly are still far behind the chip vendor's target.
Friday 15 April 2022
TSMC on track to move 3nm process to volume production in 2H22
TSMC is on track to move 3nm process technology to volume production in the second half of this year, according to company CEO CC Wei, who also reiterated the foundry's plans to launch...
Friday 1 April 2022
SMIC posts 13% wafer ASP rise in 2021
Semiconductor Manufacturing International (SMIC) saw its gross margin climb to a record high of 30.8% in 2021, when its wafer ASPs rose 13.1% to CNY4,763 (US$749.9) from CNY4,210...
Thursday 31 March 2022
SMIC says production at Shanghai site unaffected by COVID lockdown
China-based pure-play foundry SMIC has said that production at its manufacturing site in Shanghai, where 8- and 12-inch fabrication lines are operated, remains normal and has not...
Thursday 24 March 2022
Samsung, Intel keen to take slices of foundry market from TSMC
Samsung Electronics and Intel have both stepped up efforts to expand their respective foundry businesses, eyeing bigger slices of the global foundry market particularly in the advanced...
Tuesday 22 March 2022
TSMC to see orders for auto chips ramp up
TSMC is expected to see orders for automotive electronics chips rise at a faster-than-expected pace, according to industry sources.
Thursday 3 March 2022
TSMC reportedly to break ground for new Japan fab in April
TSMC is scheduled to break ground for its new wafer fab in Kumamoto, Japan in April 2022, according to Japanese media reports.
Tuesday 22 February 2022
TSMC obtains significant sub-7nm chip orders
TSMC has secured significant orders demanding its sub-7nm process manufacturing from major US vendors, according to sources at semiconductor equipment suppliers.
Tuesday 22 February 2022
Yield is key for TSMC-Samsung race in 3nm chip production
TSMC and Samsung Electronics are set to enter a race for 3nm chip production as they both plan to start commercial production of the most advanced available process node in the second...
Friday 11 February 2022
SMIC posts profit hike in 2021
Semiconductor Manufacturing International (SMIC) has reported revenue hit a record high of US$5.44 billion in 2021, when profits attributable to the company hiked to US$1.7 billion...
Monday 26 March 2018
Samsung Exynos 7 Series 9610
Samsung Electronics has announced the availability of its latest application processor (AP), the Exynos 7 Series 9610, built using the company's 10nm FinFET process. The new Exynos 9610 supports deep learning-based visual processing, 480 fps slow-motion recording and other multimedia features in high-end smartphones, the company noted. Samsung's Exynos 9610 SoC consists of four Cortex-A73 cores clocked at 2.3GHz and four ARM Cortex-A53 cores running at 1.6GHz, and features the second-generation Bifrost-based ARM Mali-G72 GPU. Samsung expects to enter mass production of the Exynos 7 Series 9610 chips in the second half of 2018.
Tuesday 18 October 2016
Samsung 14nm chips for wearables
Samsung Electronics has announced mass production of the Exynos 7 Dual 727 mobile application processor (AP) designed specifically for wearable devices with 14nm FinFET process technology. Powered by two Cortex-A53 cores, the Exynos 7270 makes full use of the 14nm process, delivering 20% improvement in power efficiency when compared to its predecessor built on 28nm, and thus notably extending the battery life, Samsung said. By integrating Cat.4 LTE 2CA modem, the new AP allows wearables to connect to a cellular service as a stand-alone device. Tethering and data transfer between devices is also possible with its embedded WiFi and Bluetooth connectivity. In addition, integrated connectivity capabilities support FM radio, and location-based services with GNSS (global navigation satellite system) solutions.
Wednesday 31 August 2016
Samsung 14nm Exynos chips
Samsung Electronics has begun mass production of Exynos 7 Quad 7570, the company's newest mobile application processor (AP) built on 14nm process technology for the budget smartphone market as well as other IoT devices. Last year, Samsung adopted advanced 14nm FinFET technology for its premium processors and has since expanded the adoption to other segments, bringing premium features to more affordable smart devices. Exynos 7570, with four Cortex-A53 cores in 14nm, delivers 70 improvements in CPU performance and 30% improvement in power efficiency when compared to its predecessor built on 28nm. The new Exynos also offers a fully connected mobile experience by integrating a Cat. 4 LTE 2CA modem and various connectivity solutions, such as WiFi, Bluetooth, FM radio and GNSS. Additionally, with design optimization and feature consolidation for components such as PMICs and RF functionalities, Exynos 7570 reduces the total chipset size by up to 20%, giving manufacturers better ability to craft slimmer smartphones, according to Samsung. It supports screen resolution up to WXGA, record and playback of videos in Full HD, and improved ISP (image signal processor) for 8Mp/13Mp front and back cameras.
May 19, 12:09
Computex Focus: DataVan to showcase new retail solutions for new normal
Thursday 19 May 2022
STAr Technologies unveils one-touch memory test probe card
Wednesday 18 May 2022
Advanced vision AI eliminates potential risks in cleanroom environments for semiconductor and panel manufacturers
Wednesday 11 May 2022
NeoGene unveils novel ultra-thin heat-pipe-array vapor chamber technology for ultra-high-density power battery pack application
Notebook production in China unlikely to be fully restored until July
IC design houses under pressure to drop prices
Brand notebook vendors cut orders for 2022
YMTC sampling 192-layer 3D NAND chips
Datacenters to become biggest consumer of NAND flash in 2023-2024
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
EV penetration to rise to 30% in 2025, says DIGITIMES Research
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – February 2022
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