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Tuesday 3 December 2024
Airoha secures R&D funding, challenges Qualcomm with Bluetooth audio chips
According to Taiwan's Ministry of Economic Affairs, MediaTek subsidiary Airoha has secured NT$140 million (US$4.3 million) in R&D subsidies through the ministry's A+ Industrial...
Tuesday 3 December 2024
Denso, Fuji Electric secure METI subsidy for SiC chip mass production
Japan's Ministry of Economy, Trade, and Industry (METI) has announced a subsidy program totaling up to JPY70.5 billion (US$470.34 million) for the SiC power semiconductor production...
Monday 2 December 2024
Kioxia's IPO set to reshape memory industry
Japanese NAND manufacturer Kioxia has secured approval for its initial public offering (IPO) on the Tokyo Stock Exchange, scheduled for December 18. South Korean SK Hynix may acquire...
Friday 29 November 2024
Japan doubles down on semiconductor subsidies, Rapidus poised for more support
The Japanese government is preparing a budget amendment for fiscal year 2024 (April 2024 – March 2025) to allocate additional support for the semiconductor and AI sectors, with...
Tuesday 26 November 2024
Intel secures US$7.865 billion in CHIPS Act subsidies, lower than initial memorandum amount
Revised Award Provides Up to $7.865 Billion in Direct Funding, Down from $8.5 Billion, to Support Intel's $100+ Billion Expansion Plan Across Four U.S. States
Tuesday 26 November 2024
Taiwan's TMYTEK aims for IPO after securing US$25M Series B for satellite tech
Taiwan-based millimeter wave (mmWave) technology company TMYTEK is preparing to go public next year following a successful US$25 million Series B funding round that brought its total...
Tuesday 26 November 2024
US grants US$59 million in chip subsidy to BAE Systems, Rocket Lab
The US Department of Commerce has awarded two significant grants under the CHIPS Incentives Program. The funding will go to BAE Systems and Rocket Lab to advance the country's supply...
Monday 25 November 2024
Raimondo's race against time: Intel, Samsung CHIPS Act deals hang in balance
As Donald Trump's inauguration fast approaches, Gina Raimondo, the US Secretary of Commerce, revealed to Politico that she instructed Commerce Department staff to work overtime...
Friday 22 November 2024
Japan plans to allocate JPY10 trillion to support seven-year initiative in semiconductors, AI
The Japanese government is preparing to provide over JPY10 trillion (approx. US$65 billion) in support for the semiconductor and AI industries by the fiscal year 2030 (April 2030...
Friday 22 November 2024
Japan halts funding for all-polymer battery firm APB amid company crisis
Japanese authorities have officially terminated subsidies for APB Corp, a pioneer in next-generation all-polymer battery technology, amid severe financial difficulties and leadership...
Thursday 21 November 2024
U.S. government announces up to $300 million in funding to boost advanced semiconductor packaging
The U.S. government announced plans to invest up to $300 million in three advanced semiconductor packaging research projects located in Georgia, California, and Arizona. These projects...
Thursday 21 November 2024
GlobalFoundries cements Chips Act deal for US$1.5 billion grant
The Biden administration has finalized Chips Act incentives for GlobalFoundries (GF), awarding the chipmaker US$1.5 billion in grants to support US factories as part of a broader...
Monday 18 November 2024
Moore Threads initiates A-share IPO process with a valuation of approximately CNY25 billion
According to an announcement on the China Securities Regulatory Commission's (CSRC) official website, Chinese GPU manufacturer Moore Threads completed registration with the Beijing...
Friday 15 November 2024
TSMC Arizona secures $6.6 billion CHIPS incentives funding to bolster U.S. leadership in advanced semiconductor manufacturing
The U.S. Government has announced that the U.S. Department of Commerce will award up to $6.6 billion in direct funding to TSMC Arizona Corporation (TSMC Arizona), a subsidiary of...
Friday 15 November 2024
Akash Systems lands CHIPS Act funding to advance AI with diamond cooling technology
On November 13, the US government announced a non-binding preliminary agreement with Akash Systems. Through the CHIPS and Science Act, the Department of Commerce intends to allocate...
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research