AMD has informed its partners that it plans to launch in February 2018 an upgrade version of its Ryzen series processors built using a 12nm low-power (12LP) process at Globalfoundries,...

Global foundries will hold a "topping out" ceremony to celebrate a major milestone of the construction of its new 12-inch wafer plant in Chengdu, China at the end of October, according...

Globalfoundries has announced plans to introduce a new 12nm leading-performance (12LP) FinFET semiconductor manufacturing process. The technology is expected to deliver better density...

Taiwan Semiconductor Manufacturing Company (TSMC) is expected to grab 70-80% of the total orders for Qualcomm's new-generation power management ICs (PWM IC), according to industry...

In 2017, the 7% increase in the total pure-play foundry market is forecast to be almost entirely due to an 18% jump in sub-40nm feature size device sales, according to IC Insights.

Gudeng Precision Industrial has obtained front opening unified pod (FOUP) orders from a number of 12-inch foundries including United Semiconductor (Xiamen), Huali Microelectronics...

ASML has disclosed annual production of its extreme ultraviolet (EUV) lithography systems will increase to 20 units in 2018 from the current 12.

AMD will continue to contract Globalfoundries to manufacture its next-generation Vega GPUs, and will have Siliconware Precision Industries (SPIL) as its major packager for the chips,...

AMD's new Radeon RX Vega series graphics cards, which have become available since August 15, are currently seeing tight supply in the retail channel reportedly due to an insufficient...

ASML has announced the opening of a new branch office in Nanjing, China where its major client TSMC is constructing a new 12-inch wafer plant.

Globalfoundries has demonstrated silicon functionality of a 2.5D packaging solution for its 14nm FinFET FX-14 integrated design system for application-specific integrated circuits...

Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics (UMC) have recently secured 1-2 year supply contracts with Shin-Etsu and Sumco and offered higher prices...

MediaTek plans to transfer part of its 28nm mobile chip orders, including those for the Amazon Echo Dot, to United Microelectronics (UMC) from Taiwan Semiconductor Manufacturing Company...

Samsung Electronics, Dongbu HiTek and SK Hynix have stepped up their foundry business expansions, which will as a group pose a threat to the existing major dedicated foundry houses...

Meizu is scheduled to introduce its new Pro 7 and Pro 7 Plus smartphone series on July 26. The Pro 7 model is expected to feature MediaTek's 16nm Helio P25 SoC chip while the Pro...