An extended COVID lockdown in Kunshan, China is not much constraining PCB and IC substrate supply from plants there operated by Taiwan-based makers Unimicron Technology and Nan Ya...
Taiwan's IC test interface specialists including Chunghwa Precision Test Tech (CHPT) are striving hard to strengthen deployments in multiple market segments beyond handsets as demand...
Cooling fan maker Power Logic is optimistic about its business operation in the second half of 2022, according to company chairman and president Vincent Hsu at a March 31 investor...
MediaTek will continue to penetrate its 4G and 5G handset APs into Samsung Electronics midrange smartphone models in 2022, allowing its backend partners in Taiwan to benefit and indirectly...
Samsung Electronics and Intel have both stepped up efforts to expand their respective foundry businesses, eyeing bigger slices of the global foundry market particularly in the advanced...
Nvidia has announced its next-generation accelerated computing platform with Hopper architecture, dubbed H100 GPU, which is built using TSMC's 4nm (N4) process customized for the...
Nvidia is set to launch new HPC GPU platforms for datacenter, AI and gaming applications in 2022, and its manufacturing partner TSMC reportedly is expected to triple order placements...
Samsung Electronics has made an unusual move by responding to its negative rumors - one about the Game Optimisation Service (GOS) app on the Galaxy S22 series; and the other regarding...
Taiwan's leading PCB specialist Zhen Ding Technology is gearing up to carry out its ambitious 10-year development roadmaps for IC substrates, aiming to rank among the world's top-5...
Taiwan-based main motherboard (mobo) and graphic card vendors including Asustek Computer, Gigabyte Technology and Micro-Star International (MSI), as well as smaller peers ASRock and...
The emergence of 5G, Artificial Intelligence (AI) and Internet of Things (IoT) technologies can unlock digital transformation to meet the needs of various industries such as manufacturing,...
Taiwan's OSATs are slowing down their logic IC wirebonding capacity expansions as the visibility of orders for processing consumer ICs is still unclear beyond the second quarter of...
It remains to be seen how Intel will materialize its IDM 2.0 growth vision, but the chipmaker will have to face a trade-off between production cost and chip performance in determining...
Kinsus Interconnect Technology is on track to expand its production capacity for ABF substrates by 30-40% in 2022, and by another 40% in 2023, to meet ever-increasing demand for processing...
SK Hynix has developed processing-in-memory (PIM), a next-generation memory chip with computing capabilities, according to the company. PIM provides a solution for data congestion...
