中文網
Taipei
Sun, Sep 19, 2021
09:18
mostly clear
30°C
CONNECT WITH US
NEWS TAGGED GREATEK
Friday 10 September 2021
Taiwan OSATs install additional wire-bonding equipment
Taiwan OSATs, including ASE Technology, Greatek Electronics, Lingsen Precision Industries and Orient Semiconductor Electronics (OSE), have all begun to install additional wire-bonding...
Friday 3 September 2021
Backend firms see robust demand for MEMS microphones, audio ICs
Taiwan's backend houses including ASE Technology, Greatek Electronics, Orient Semiconductor Electronics (OSE), Lingsen Precision Industries and Taiwan IC Packaging have seen clear...
Tuesday 24 August 2021
China OSATs strengthen QFN packaging capability for car chips
China-based OSATs including JCET, Tongfu Microelectronics and Tianshui Huatain Technology have all moved to enhance their QFN (quad flat no-lead) packaging capability for automotive...
Monday 16 August 2021
Sony to score big from vigorous PS5 sales in 2021
Demand for games consoles continues to gain momentum amid persistent stay-at-home activities, allowing Sony Interactive Entertainment (SIE) to score big from the sales of its next-generation...
Friday 6 August 2021
OSATs, power chips makers gain shifted orders from ASEAN
Shortages of automotive MOSFET and power management ICs are getting worse as many IDMs including Infinenon and On-Semi are operating at reduced capacity at their plants in Malaysia,...
Thursday 29 July 2021
Taiwan supply chain gearing up shipments for new iPhones
TSMC and other Taiwan partners in the chips supply chain for iPhones are gearing up to start fulfilling initial orders for new iPhones slated for launch later this year including...
Wednesday 28 July 2021
PTI raises capex outlook for 2021
Logic and memory IC backend house Powertech Technology (PTI) has revised upward its capex target this year to NT$17 billion (US$606.05 million) from the NT$15 billion estimated pre...
Friday 23 July 2021
Automotive IC IDMs in talks with OSATs about demand in 2022
First-tier automotive IC IDMs in the US, Japan and Europe have reportedly approached OSATs including ASE Technology, Powertech Technology (PTI) and Greatek Electronics to book backend...
Friday 23 July 2021
Wire-bonding quotes to hike again in 1H22 as materials costs surge
OSATs are expected to raise their quotes again for wire-bonding packaging services in the first half of 2022 to reflect ever-rising costs for materials such as leadframes and molding...
Thursday 22 July 2021
Backend houses see lead times prolonged notably
Backend houses have seen their delivery lead times for MCUs, audio ICs, USB interface ICs and power management chips extend all the way to as long as two months from the previous...
Tuesday 13 July 2021
Taiwan 2nd-tier OSATs to embrace bright prospects for 2H21
Taiwan's second-tier IC backend houses are set to embrace brisker business results for the second half of the year thanks to a significant surge in customer orders, after posting...
Monday 12 July 2021
ASE Technology to score big in 3Q21 from serving heavyweights
Taiwan's leading OSAT ASE Technology Holding will see big orders from major clients Apple, Qualcomm and MediaTek further power its revenue growth in the third quarter after posting...
Wednesday 9 June 2021
OSATs to log full wire-bonding capacity utilization throughout 2021
Taiwan backend houses have seen clear order visibility for wire-bonding packaging services for notebook- and PC-use peripheral chips throughout 2021, while continuing to embrace strong...
Wednesday 9 June 2021
PSMC confirms one employee infected with coronavirus
Powerchip Semiconductor Manufacturing (PSMC) has said one of its domestic employees at its factory site in Miaoli County, northern Taiwan has been confirmed infected with COVID-19,...
Tuesday 8 June 2021
Taiwan backend capacity tightens further on COVID cluster infections
Taiwan's backend capacity supply is being further constrained by COVID cluster infections at some OSATs including King Yuan Electronics (KYEC) and Greatek Electronics.