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NEWS TAGGED GREATEK
Monday 17 January 2022
QFN packaging increasingly adopted for B2B networking chips
Taiwan suppliers of B2B networking chips are moving to adopt QFN technology for packing their products amid the growing shortage of substrates for FC (flip-chip) production, increasing...
Thursday 13 January 2022
China OSATs to cut prices for MCU packaging in 1H22
China-based OSATs, including Jiangsu Changjiang Electronics Technology (JCET), plan to cut quotes for consumer MCU and other conventional chip packaging services in the first half...
Monday 15 November 2021
Car MCU crunch on track to ease, ADAS chip shortage emerging
Shortage of automotive MCUs will remain on track to ease in 2022, but a new wave of uneven component supply will be emerging and may last till 2023 with core chips for ADAS to lead...
Tuesday 26 October 2021
Holtek says no plan to raise prices for MCUs
Holtek Semiconductor has no plans to raise its MCU and other consumer IC prices despite foundry costs continuing to rise, as Chinese peers are striving to win more orders for small...
Friday 8 October 2021
PTI to post flat or slight revenue growth in 4Q21
Powertech Technology (PTI) is expected to post flat or slight sequential revenue growth in the fourth quarter of 2021, when the backend house will see demand for logic chips outperform...
Tuesday 5 October 2021
Wire-bonding demand for consumer chips may slow down in 2022
Demand for wire-bonding packaging is likely to slow down in 2022 as backend houses have decided to defer installation of new wire-bonders that have reached them following long delivery...
Friday 10 September 2021
Taiwan OSATs install additional wire-bonding equipment
Taiwan OSATs, including ASE Technology, Greatek Electronics, Lingsen Precision Industries and Orient Semiconductor Electronics (OSE), have all begun to install additional wire-bonding...
Friday 3 September 2021
Backend firms see robust demand for MEMS microphones, audio ICs
Taiwan's backend houses including ASE Technology, Greatek Electronics, Orient Semiconductor Electronics (OSE), Lingsen Precision Industries and Taiwan IC Packaging have seen clear...
Tuesday 24 August 2021
China OSATs strengthen QFN packaging capability for car chips
China-based OSATs including JCET, Tongfu Microelectronics and Tianshui Huatain Technology have all moved to enhance their QFN (quad flat no-lead) packaging capability for automotive...
Monday 16 August 2021
Sony to score big from vigorous PS5 sales in 2021
Demand for games consoles continues to gain momentum amid persistent stay-at-home activities, allowing Sony Interactive Entertainment (SIE) to score big from the sales of its next-generation...
Friday 6 August 2021
OSATs, power chips makers gain shifted orders from ASEAN
Shortages of automotive MOSFET and power management ICs are getting worse as many IDMs including Infinenon and On-Semi are operating at reduced capacity at their plants in Malaysia,...
Thursday 29 July 2021
Taiwan supply chain gearing up shipments for new iPhones
TSMC and other Taiwan partners in the chips supply chain for iPhones are gearing up to start fulfilling initial orders for new iPhones slated for launch later this year including...
Wednesday 28 July 2021
PTI raises capex outlook for 2021
Logic and memory IC backend house Powertech Technology (PTI) has revised upward its capex target this year to NT$17 billion (US$606.05 million) from the NT$15 billion estimated pre...
Friday 23 July 2021
Automotive IC IDMs in talks with OSATs about demand in 2022
First-tier automotive IC IDMs in the US, Japan and Europe have reportedly approached OSATs including ASE Technology, Powertech Technology (PTI) and Greatek Electronics to book backend...
Friday 23 July 2021
Wire-bonding quotes to hike again in 1H22 as materials costs surge
OSATs are expected to raise their quotes again for wire-bonding packaging services in the first half of 2022 to reflect ever-rising costs for materials such as leadframes and molding...