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Thursday 28 July 2022
PTI expects flat performance in 3Q22
Powertech Technology (PTI) will be striving to keep its third-quarter revenue about on par with the second-quarter level amid volatile market conditions, according to the memory and...
Monday 11 July 2022
ASE, PTI poised to embrace strong 2H22
Taiwan's leading OSATs ASE Technology and Powertech Technology (PTI) managed to score impressive revenue gains in the first half of 2022 and are expected to perform even better in...
Monday 4 July 2022
Consumer IC packaging demand unlikely to rebound till 1Q23
Packaging demand for consumer electronics ICs including commodity MCUs, MOSFETs, lower-end logic ICs and power management ICs (PMICs) has contracted significantly amid lackluster...
Wednesday 22 June 2022
Second-tier OSATs see uncertainty in order visibility for 2H22
Unlike ASE Technology and other first-tier OSATs who still see robust order momentum from their IDM customers, smaller-size players including Greatek Electronics, Lingsen Precision...
Tuesday 24 May 2022
Chiplet processing demand on the rise
While their consumer IC packaging business continues to slow down, Taiwan OSATs have received increasing inquiries about chiplet manufacturing solutions from clients in the US, China...
Wednesday 30 March 2022
Smaller OSATs may cut quotes to win wirebonding orders in 2H22
A wirebonding capacity supply glut is arising from fast capacity expansions at OSATs, which may lead them to cut quotes in the second half of 2022 to bolster their capacity utilization,...
Monday 7 March 2022
OSATs slowing down wirebonding capacity expansions for 2H22
Taiwan's OSATs are slowing down their logic IC wirebonding capacity expansions as the visibility of orders for processing consumer ICs is still unclear beyond the second quarter of...
Wednesday 26 January 2022
Greatek expects automotive IC backend sales to double in 2022
Logic IC packaging specialist Greatek Electronics expects its revenues from processing automotive chips to double in 2022 from 2021, driven by commercialization of additional fab...
Wednesday 26 January 2022
With high revenue in 1Q22, PTI considers deals with Micron, SK Hynix
Backend house Powertech Technology (PTI) expects to post a double-digit on-year revenue surge in the first quarter of 2022 after posting record business results for 2021, and is optimistic...
Friday 21 January 2022
Wi-Fi 7 will spark demand for QFN packaging, burn-in testing
With chip vendors (including Broadcom, Intel, MediaTek, and Qualcomm) gearing up for the development of Wi-Fi 7 chip solutions, QFN packaging and burn-in testing demand will be ramping...
Monday 17 January 2022
QFN packaging increasingly adopted for B2B networking chips
Taiwan suppliers of B2B networking chips are moving to adopt QFN technology for packing their products amid the growing shortage of substrates for FC (flip-chip) production, increasing...
Thursday 13 January 2022
China OSATs to cut prices for MCU packaging in 1H22
China-based OSATs, including Jiangsu Changjiang Electronics Technology (JCET), plan to cut quotes for consumer MCU and other conventional chip packaging services in the first half...
Monday 15 November 2021
Car MCU crunch on track to ease, ADAS chip shortage emerging
Shortage of automotive MCUs will remain on track to ease in 2022, but a new wave of uneven component supply will be emerging and may last till 2023 with core chips for ADAS to lead...
Tuesday 26 October 2021
Holtek says no plan to raise prices for MCUs
Holtek Semiconductor has no plans to raise its MCU and other consumer IC prices despite foundry costs continuing to rise, as Chinese peers are striving to win more orders for small...
Friday 8 October 2021
PTI to post flat or slight revenue growth in 4Q21
Powertech Technology (PTI) is expected to post flat or slight sequential revenue growth in the fourth quarter of 2021, when the backend house will see demand for logic chips outperform...