Global Unichip Corp. (GUC), the Advanced ASIC Leader, is pleased to announce that its 3nm HBM3E Controller and PHY IP have been adopted by a leading Cloud Service Provider (CSP) and...
FuriosaAI Inc. is pleased to announce its collaboration with GUC (Global Unichip Corporation) as a key partner on the secondgen AI accelerator, RNGD (pronounced "Renegade"), the most...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that the GLink-3D interface (GUC's Link for 3D die stacking) for the TSMC 3DFabric SoIC-X 3D stacking platform...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out Universal Chiplet Interconnect Express (UCIe) PHY IP with 32Gbps per lane,...
According to industry sources, more cloud service providers (CSP) are building their own AI chips, which benefits Taiwan-based ASIC service and silicon IP providers.
Global Unichip, an IC design services provider partnering mainly with TSMC, has lowered its revenue growth forecast for 2023 to a single-digit percentage, according to a report by...
AI has not only become the most important keyword in the entire tech industry but also driven major cloud service providers to gear up efforts to develop their own computing chips...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out a test chip with an 8.6Gbps HBM3 Controller and PHY and GLink 2.3LL for AI/HPC/xPU/Networking...
Main IC design houses under the ecosystem of Samsung Electronics are actively recruiting new talent despite the recent layoff wave at the tech sector, riding on the rise of ChatGPT...
IC design service company Global Unichip expects to post a double-digit revenue surge in 2023, thanks to a ramp-up in orders for non-recurring engineering (NRE) designs and turnkey...
TSMC and its ecosystem partners in Taiwan, especially silicon IP and IC design services providers, remain able to embrace revenue gains for the fourth quarter and 2023, while most...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced that GLink 2.3LL (GUC's die-to-die Link) interface IP for TSMC CoWoS and InFO chiplets integration platforms passed...
The actual semiconductor inventory storm has not yet arrived, and different supply chain segments will show starkly divided performances in the fourth quarter of the year, with most...
Global Unichip Corp. (GUC), the leader in Advanced ASIC, announced that they have silicon proved their 7.2 Gbps HBM3 solution, using SK hynix's first available HBM3 samples. The platform...
