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    NEWS TAGGED HBM3E
    Thursday 5 June 2025
    CXMT's surprise HBM3 sprint puts Samsung, SK Hynix on alert
    China's CXMT is accelerating its development of high-bandwidth memory (HBM) and DDR5 chips, mounting a direct challenge to the global DRAM dominance of Samsung Electronics and SK...
    Thursday 5 June 2025
    Samsung Foundry’s 2025 Forum signals shift in strategy
    Samsung Electronics, once known for showcasing its "super gap" or "ultra gap" in chipmaking prowess, has taken an uncharacteristically quiet approach to its 2025 foundry events. The...
    Wednesday 4 June 2025
    Samsung executives visit Nvidia headquarters to secure HBM supply deal
    Samsung Electronics memory division executives traveled to Nvidia's US headquarters in late May to advance large-scale high-bandwidth memory (HBM) supply arrangements, according to...
    Monday 2 June 2025
    Weekly news roundup: Huawei's 5nm PC, Wolfspeed's SiC crisis, and China's export chokehold
    These are the most-read DIGITIMES Asia stories from May 26 to June 1. Top highlights include Huawei's 5nm HarmonyOS PC as a milestone in China's chip self-sufficiency, Wolfspeed's...
    Wednesday 28 May 2025
    Samsung races to deliver HBM3E memory to Nvidia but faces certification hurdles
    In the high-stakes race to supply memory for the next generation of artificial intelligence, Samsung Electronics is under mounting pressure to deliver its 12-layer HBM3E chips to...
    Monday 26 May 2025
    Samsung edges toward Nvidia HBM3E approval, but SK Hynix remains dominant

    Samsung Electronics may clear Nvidia's certification for its 12-layer HBM3E memory, but industry sources say the achievement is unlikely...

    Friday 23 May 2025
    Samsung launches Dual-Site 1c DRAM expansion to bolster HBM4 leadership
    Samsung Electronics is doubling down on its leadership in advanced memory technology. Following its latest developments at the Pyeongtaek facility, industry sources report that Samsung...
    Thursday 22 May 2025
    Trump's Middle East trip spurs major AI infrastructure deals, highlights energy and chip synergies
    US President Donald Trump's recent visit to the Middle East has emerged as a significant catalyst for the global AI industry, sparking new partnerships and investments aimed at addressing...
    Thursday 22 May 2025
    Nvidia CEO shows support for SK Hynix, praises 'beautiful' HBM4 at Computex 2025
    Nvidia CEO Jensen Huang made a special visit to the SK Hynix booth at Computex 2025, leaving messages of support and showing the close cooperative relationship between the two comp...
    Tuesday 6 May 2025
    SK Hynix-Hanmi Semiconductor dispute escalates, Hanwha Semitech poised to gain
    A brewing conflict between SK Hynix and its long-time supplier, Hanmi Semiconductor, over thermal compression bonder (TC Bonder; TCB) equipment has intensified, potentially reshuffling...
    Friday 2 May 2025
    Samsung chip earnings nosedive 62%: HBM edge ceded to SK Hynix?
    Samsung Electronics beat expectations in the first quarter of 2025, posting revenue of KRW79.1 trillion (US$55 billion) and operating profit of KRW6.7 trillion. However, its Device...
    Wednesday 30 April 2025
    Samsung reportedly exits HBM2E under Chinese price offensive, shifts focus to high-end market
    Samsung Electronics is cutting production of mature-node DDR4 memory and reportedly scaling back its third-generation high-bandwidth memory (HBM2E) business to focus resources on...
    Friday 25 April 2025
    Exclusive: Google considers HBM3E supplier change
    Samsung Electronics has recently intensified its deployment in advanced high bandwidth memory (HBM) processes. However, supply chain sources reveal that Samsung's HBM3E certification...
    Thursday 24 April 2025
    SK hynix announces 1Q25 financial results
    SK hynix (or "the company") announced today that it recorded KRW17.6391 trillion in revenues, KRW7.4405 trillion in operating profit (with an operating margin of 42%), and KRW8.1082...
    Monday 21 April 2025
    Samsung makes headway in HBM4 chip yields, signaling a potential comeback in the high-end memory race

    As rivals race ahead in HBM3E, Samsung quietly builds momentum in next-gen HBM4 development, banking on its in-house chipmaking and packaging...

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    Research Report Database
    BIZ FOCUS
    Jun 6, 13:41
    Ensuring precision: Kuehne+Nagel's certified quality logistics for the semiconductor industry
    Thursday 5 June 2025
    Darveen signs distributor agreement with IP SYSTEMES to expand market presence in France
    Thursday 5 June 2025
    BIOSTAR concludes COMPUTEX 2025 on a high note with the debut of Edge-Comp series and edge AI platforms
    Wednesday 4 June 2025
    "Revenge Seekers" team develops AI-powered emergency assistant to improve disaster response efficiency.
    RESEARCH INSIGHTS
    Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES