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NEWS TAGGED HDI
Tuesday 28 April 2009
More use of HDI for TFT-LCD panels happening in notebooks, say Taiwan makers
More notebook makers are starting to adopt high-density interconnect (HDI) boards for the TFT-LCD panels in their notebooks, and the use of HDI boards in notebooks is expected to...
Tuesday 21 April 2009
High-end handsets drive demand for three-layer HDI boards
Demand for 3+n+3 high-density interconnect (HDI) boards or above has been pushed up as more handset chip companies, including Qualcomm, Texas Instruments (TI) and STMicroelectronics,...
Wednesday 15 April 2009
PCB maker 2Q09 revenues expected to grow 20% on notebook demand
PCB makers Gold Circuit Electronics (GCE), HannStar Board, Tripod Technology and Unitech Printed Circuit Board will likely enjoy 15-20% revenue growth sequentially in the second quarter,...
Monday 6 April 2009
EMS and PCBA companies expected to increase investment in testing equipment as notebook HDI demand picks up
EMS and PCB assembly (PCBA) companies are purchasing testing equipment including AOI and AXI equipment in anticipation of increased demand for notebook-use high-density interconnect...
Wednesday 1 April 2009
Notebook PCB ASPs expected to raise on shift to HDI boards
Taiwan's PCB makers expect the shift to high-density interconnect (HDI) boards to help raise the ASPs of notebook PCBs, and are looking forward to the upcoming launch of ultra-thin...
Wednesday 25 March 2009
PCB makers gear up for HDI boards used in low-cost notebooks
The upcoming launch of Intel's consumer ultra-low voltage (CULV) CPUs, which target ultra-portable notebooks priced between US$699-899, will help significantly increase demand for...
Wednesday 25 March 2009
Compeq, GCE and Unimicron land PCB orders for Dell Adamo notebook
Taiwan-based PCB makers Compeq Manufacturing, Gold Circuit Electronics (GCE) and Unimicron Technology have secured orders of high-density interconnect (HDI) boards for Dell's Adamo...
Wednesday 18 March 2009
Gold Circuit Electronics runs China PCB facility to nearly full capacity
PCB maker Gold Circuit Electronics (GCE) has said that its Changshu plant (Jiangsu Province, China) is running at almost full utilization, thanks to rising shipments for netbooks...
Monday 16 March 2009
Demand for notebook HDI boards increases
Demand for notebook-use high-density interconnect (HDI) boards is warming up, as strong sales of netbooks and the launch of Intel's ultra-low voltage (CULV) platform are spurring...
Monday 22 December 2008
FPCB makers Career and Unitech to see smartphone segment continue driving sales 1Q09
Although the global financial crisis has impacted overall handset demand, the smartphone segment is performing relatively better. Thanks to healthy orders from the smartphone segment,...
Friday 14 November 2008
Notebook PCB makers HannStar Board and GCE push back expansion projects for 2009
Having downward adjusted their fourth-quarter guidance recently, the two major Taiwan notebook PCB makers – HannStar Board and Gold Circuit Electronics (GCE) – have also...
Tuesday 11 November 2008
PCB maker GCE braces for sales decline in 4Q08 on HDI orders cut
PCB maker Gold Circuit Electronics (GCE) expects to see 10-15% sales decline in the fourth quarter after customers asked to delay October shipments of high-density interconnect (HDI)...
Monday 6 October 2008
TPCA Show 2008 to begin on October 22
The Taiwan Printed Circuit Association's (TPCA's) annual event (TPCA Show 2008) is to be held between October 22-24. 357 exhibitors across 1,634 booths are registered to participate,...
Friday 3 October 2008
TKK benefiting from IC substrate and PV customers; 2009 outlook optimistic
Although the general economy is weak, semiconductor equipment distributor Taiwan Kong King's (TKK's) sales and profits will continue to grow thanks to the capacity expansions of IC...
Tuesday 30 September 2008
Three- and four-layer HDI board demand to increase ASPs for handset PCBs
In order to fulfill the demands of high-end smartphones, high-density interconnect (HDI) boards have become more advanced since 2007. As the proportion of 3+n+3 and 4+n+4 stack-in...