CMOS image sensor (CIS) packaging house Tong Hsing Electronic expects modest sequential shipment growth in the fourth quarter of 2023, as communication module and car sales momentum...
Tong Hsing Electronic Industries, VisEra Technologies, and Xintec, all of whom are in the CMOS image sensor (CIS) backend sector, have expressed caution regarding their market prospects...
Tong Hsing Electronics, a major backend services provider for CMOS image sensors (CIS), expects the handset market to remain weak throughout 2023, with demand sliding faster than...
Taiwan-based CMOS imagery sensor (CIS) packaging giant Tong Hsing Electronics, an affiliate of the Yageo Group, has been working actively to make adjustments to its shareholding in...
Tong Hsing Electronic Industries has revised its automotive CIS business outlook from highly optimistic to just positive, according to the packaging house.
With its importance significantly highlighted during the Russia-Ukraine war, low-earth orbit (LEO) satellite communications will usher in enormous business opportunities for III-V...
CIS packaging and testing firm Tong Hsing Electronic is expected to see sales generated from the automotive applications register a high single-digit percentage growth in 2023.
China-based CMOS image sensor (CIS) supplier OmniVision Technologies continues the release of new products despite market downturns, focusing on handset, automotive and metaverse...
Lackluster handset sales have led to excess inventories of related CMOS image sensors (CIS), also dragging down wafer reconstitution (RW) demand, according to industry sources.
CMOS image sensor (CIS) packaging service provider Tong Hsing Electronic Industries is constructing its fourth plant in northern Taiwan, with the facility to begin production in the...
CMOS image sensor backend specialists including Tong Hsing Electronic Industries and Xintec are vying for more orders coming from the automotive sector to offset weakness in handset...
Like handset CMOS image sensors, automotive CIS will likely be built based on the backend wafer reconstruction technology for a shorter verification cycle, according to industry so...
