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NEWS TAGGED TONG HSING
Wednesday 30 September 2020
CIS packager Tong Hsing to ramp up shipments for healthcare applications
Tong Hsing Electronic Industries, which supplies ceramic substrates and backend services for CMOS image sensors (CIS) and other niche ICs, has been stepping up its deployment in the...
Friday 17 July 2020
CIS packager Tong Hsing breaks ground for new plant in Taiwan
Tong Hsing Electronic Industries, which supplies ceramic substrates and backend services for CMOS image sensors (CIS) and other niche ICs, has broken ground for a new plant complex...
Friday 17 July 2020
Passive components demand unclear in 2H20, but not pessimistic, says Yageo
The passive component market outlook for the second half of 2020 remains uncertain, but there is no need to be overly pessimistic about it, Yageo chairman Pierre Chen has said.
Tuesday 14 July 2020
CIS backend firms tap deeper into auto field with On-Semi, Sony
With major CMOS image sensor (CIS) vendors including On Semiconductor and Sony set to put increased focus on automotive applications, Taiwan-based backend houses including Tong Hsing...
Tuesday 2 June 2020
Passive component makers see demand rise on China car sales pickup
As China's car market has started picking up gradually since the second half of April, demand for auto-use passive components, diodes and MOSFET devices is expected to grow significantly...
Thursday 14 May 2020
Short lead-time orders for smartphone CIS devices emerging
Taiwan-based IC distributors have recently received an influx of short lead-time orders for CMOS image sensors (CIS) from the smartphone sector in China, with prospects of landing...
Tuesday 14 April 2020
Taiwan CIS, 3D sensor packagers see revenues rally on strong demand
CMOS image sensor (CIS) devices have seen a rapid surge in demand for security surveillance and video conferencing applications due to lockdowns amid the coronavirus pandemic. This,...
Friday 10 April 2020
Tong Hsing CIS, RF modules packaging business thriving on strong demand
Tong Hsing Electronic Industries, a specialist in wafer reconstruction, micro module assembly and backend services for CMOS image sensors and other niche ICs, continues to enjoy strong...
Tuesday 24 March 2020
CIS backend specialists expanding capacity
CMOS image sensor (CIS) backend specialists including Tong Hsing Electronic Industries and Xintec are expanding capacity seeking to satisfy growing demand for multi-lens camera pho...
Tuesday 24 March 2020
Backend firms see stable demand for TV, STB, gaming, server chips
Backend service firms have seen stable orders for processing chips for TVs, set-top boxes (STB), game consoles, cloud servers, and IP network cameras, while demand for packaging smartphone...
Tuesday 10 March 2020
CIS backend firm Tong Hsing sees January-February revenues rise nearly 20%
Taiwan-based Tong Hsing Electronic Industries, dedicated to backend services for CMOS image sensors (CIS), saw its revenues rise 19.22% on year to NT$1.272 billion (US$ 42.34 million)...
Thursday 27 February 2020
CIS backend firm Tong Hsing to double capacity by end-2020
Taiwan-based Tong Hsing Electronic Industries, dedicated to backend services for CMOS image sensors (CIS), has disclosed plans to double monthly production capacity to 150,000-160,000...
Friday 7 February 2020
CIS, VCSEL makers see robust demand for ToF phone cameras in 2H20
Taiwan-based makers of CMOS image sensor (CIS) and VCSEL components are optimistic that multi-lens camera modules incorporating ToF (time of flight) sensing technology will be mass-adopted...
Tuesday 14 January 2020
OmniVision set to raise quotes for diverse CIS devices by 10-40%
OmniVision Technologies will raise its quotes for various CMOS image sensors (CIS) by 10-40% in 2020 to counter ever-expanding demand for application to handsets, notebooks, smart...
Monday 30 December 2019
Tong Hsing, Kingpak to merge into heavyweight CIS packager in Taiwan
A heavyweight CMOS image sensor (CIS) packaging firm will be born in Taiwan soon, as Tong Hsing Electronic Industries, a handset CIS backend and wafer reconstruction specialist, has...
Holtek
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research