Supply chain insiders say that the biggest obstacles to fully electric vehicle (EV) adoption remain a lack of charging infrastructure and limited range, and following a surge in early...
BYD Co. unveiled a new hybrid powertrain capable of traveling more than 2,000 kilometers (1,250 miles) without recharging or refueling, intensifying the EV transition war against...
Generative AI will inevitably move away from cloud services, which used to rely heavily on data centers and leave some private and real-time information to be processed on "edge"...
Demand for battery EVs has faced challenges since the second half of 2023. Sales volume has sagged this year, especially in Europe and the US, the world's second and third-largest...
A rapidly growing, global market for hybrid electric vehicles should power earnings at major Asian automakers including Japan's Toyota Motor Corp. and India's Tata Motors Ltd.
Japan-based semiconductor company Renesas released its financial results for the first quarter of 2024 on April 25. The company experienced a limited profit decline and expected the...
Nvidia has introduced a cloud service built upon the CUDA-Q hybrid quantum computing platform, enabling users to conduct software tests for quantum computing.
Samsung Electronics is reportedly set to unveil its new OLED TV series, the S90D, in 2024, marking a significant move as it will adopt both Samsung Display's QD-OLED and LG Display's...
South America's largest economy sees growing automotive investment. China-based BYD recently started building an industrial complex for EVs in Brazil, aiming to produce 15,000 vehicles...
As NAND flash and high-bandwidth memory (HBM) stacking technologies continue to advance, coupled with the prospective development of 3D DRAM, the semiconductor industry is abuzz with...
Some predictions suggest that as DRAM technology development is gradually approaching a bottleneck, hybrid bonding technology may be introduced into future DRAM manufacturing processes...
With the increased prevalence of generative AI, the demand for High Bandwidth Memory (HBM) is rapidly rising, leading to heightened competition in stacking. For HBMs, a higher stack...
Artificial Intelligence (AI) is driving demand for servers, high-end chips, and advanced packaging, with 3D chips as a potential star in next-generation advanced packaging technology...
