OSAT leader ASE Technology Holding is optimistic that its growth momentum will extend through 2026 and beyond, benefiting from the short supply of advanced packaging and testing capacity...
Japanese semiconductor startup Rapidus has secured more than JPY160 billion (US$1.02 billion) in private funding for fiscal 2025, surpassing its initial JPY130 billion target, according...
Given frequent price increases across precious metals, wafer foundry services, and packaging and testing, Infineon's announcement of price increases is very telling for the market...
The global boom in generative artificial intelligence is driving an insatiable demand for computing power. This is pushing the world's largest cloud service providers to rethink a...
Powerchip Semiconductor Manufacturing Corporation, one of Taiwan's smaller but strategically positioned chipmakers, reported a sharp narrowing of losses in the fourth quarter of 2025,...
Global outsourced semiconductor assembly and test (OSAT) leader ASE Technology Holding held its earnings call, revealing that robust demand for advanced semiconductor packaging services...
Chunghwa Precision Test Tech (CHPT) reported year-over-year and month-over-month revenue growth in January. The surge was mainly driven by strong demand for AI, application processor...
As global competition in the semiconductor industry intensifies, the focus is no longer limited to technology and production capacity. Protection of data, intellectual property, and...
Renesas Electronics forecast a sharp improvement in profitability for the January to March quarter as growth in data center and other industrial infrastructure demand offsets weakness...
In a moment that blurred the lines between corporate diplomacy and fan-like devotion, TSMC CEO C.C. Wei turned a high-stakes semiconductor summit into a personal tribute on February...
The third edition of the Asia Photonics Expo (APE) opened on February 4, 2026, at the Sands Expo and Convention Centre, bringing together the global photonics and semiconductor ecosystem...
As advanced packaging technologies continue to evolve toward larger sizes and panel formats, Skytech CEO George Yi stated that in response to the key process requirements of next-generation...
Siemens has acquired French startup Canopus AI, adding AI-based metrology and inspection software to its electronic design automation (EDA) portfolio as it expands deeper into semiconductor...
TSMC has formulated a plan to mass-produce advanced 3nm chips in Kumamoto Prefecture, marking an unprecedented move within Japan. The company has notified the Japanese government of...
