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    NEWS TAGGED IC MANUFACTURING
    Friday 14 August 2026
    SMIC plans to single out AI chip revenue as demand outpaces its current reporting categories
    Semiconductor Manufacturing International Corporation (SMIC) is considering disclosing revenue from artificial intelligence (AI)-related "peripheral chips" as a standalone line item,...
    Friday 14 August 2026
    Applied Materials sets 2028 capacity target as it commits new manufacturing hires
    Applied Materials used its fiscal third-quarter earnings call to lay out a multi-year capacity build rather than just a strong quarter. Alongside record results, the company said it...
    Friday 14 August 2026
    Hua Hong's fabs were already full — price is what finally made them profitable
    Hua Hong Grace Semiconductor has been running its fabs flat out for more than a year without earning an operating profit on the work. The June quarter ended that. Revenue reached a...
    Friday 14 August 2026
    Applied Materials' growth is rotating from China volume to DRAM tooling
    Applied Materials just posted its 13th consecutive quarter of year-on-year gross margin expansion, and it did so while its largest single country market shrank. Fiscal third-quarter...
    Friday 14 August 2026
    SMIC's pricing power arrives as AI pushes mature-node work into China
    China's largest contract chipmaker has spent most of the past two years increasing volume without much to show for it in terms of margins. The June quarter broke that pattern. Semiconductor...
    Friday 14 August 2026
    Musk hints at FEL light source for Terafab; ASML eyes FEL-EUV push
    After EVs, rockets, and humanoid robots, Elon Musk appears to be turning his attention to optimizing the chip manufacturing process. When he unveiled a US$16.8 billion initial investment...
    Friday 14 August 2026
    Samsung chip design embraces AI, but loss of control and hallucinations remain a problem
    The AI wave is sweeping through the chip industry, but hallucinations, loss of control, and cybersecurity risks remain unresolved even as efficiency leaps. Youngsik Kim, head of the...
    Friday 14 August 2026
    Cerebras raises 2026 outlook as hardware sales weaken
    AI chip startup Cerebras Systems raised its full-year 2026 core revenue and gross margin outlook after reporting second-quarter results, but the company also disclosed declining hardware...
    Friday 14 August 2026
    SK Hynix advances Yongin fab construction for 2027 cleanroom launch
    SK hynix has pushed construction of its semiconductor campus in Yongin, Gyeonggi Province, South Korea, to 87% completion as it targets February 2027 for the start of operations at...
    Friday 14 August 2026
    Rapidus targets 8-reticle interposers by 2030
    Rapidus expects interposers for high-performance chips to reach eight-reticle scale by around 2030, as larger chiplets and high-bandwidth memory (HBM) push advanced packages toward...
    Friday 14 August 2026
    Samsung and SK hynix push AI deeper into fabs as semiconductor manufacturing enters autonomous era
    As the world enters an AI-powered era where the persistent need for more complex architectures is driven by rising demands for higher computing performance, one bottleneck confronting...
    Friday 14 August 2026
    ABF substrate boom lifts Eternal Precision prices 20%

    Strong Ajinomoto Build-Up Film (ABF) substrate demand has driven a surge in orders for vacuum laminating equipment, with Eternal Precision...

    Friday 14 August 2026
    Beyond silicon and copper: OCP APAC looks under the hood of future AI infrastructure
    AI's appetite for compute is growing at such speeds that simply building bigger versions of today's data centers may no longer cut it.
    Friday 14 August 2026
    Korea's CNT pellicle race heats up as aweXome Ray pushes toward EUV commercialization
    As South Korea's major memory manufacturers race to secure next-generation lithography technologies for increasingly advanced process nodes, the approaching High-NA EUV era is adding...
    Friday 14 August 2026
    Grand Process's Challentech partners with Japan's Seiki for bonding tech

    Artificial intelligence (AI) and high-performance computing (HPC) continue to drive demand for advanced packaging, where bonding technology...

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    BIZ FOCUS
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    Thursday 27 August 2026
    ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026
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