CONNECT WITH US
NEWS TAGGED IC MANUFACTURING
Thursday 31 October 2024
China's market rescue policies take effect; Holtek expresses optimism for 2025
Microcontroller unit (MCU) manufacturer Holtek has observed increasing demand for small household appliances during China's Singles' Day and Double 12 shopping festivals. The company...
Thursday 31 October 2024
GF aims to revitalize foundry business in China with team expansion planned for 2025
GlobalFoundries (GF) is looking to revitalize its operations in China. K.C. Ang, who became GF's president for Asia and chairman for China earlier this year, recently said at an annual...
Thursday 31 October 2024
Samsung breaks record in sales in 3Q24, memory business still falls short
Samsung Electronics achieved a historic high in revenue for the third quarter of 2024. Yet, overall operating profit fell short of market expectations, primarily due to one-time expenses...
Thursday 31 October 2024
Xiaomi targets Huawei and Apple with US$6.7 billion R&D push by 2025
Xiaomi, entering its fifth year in the high-end smartphone market, has once again rolled out its annual flagship phone, the Xiaomi 15, setting itself as a contender against Apple...
Thursday 31 October 2024
Second place foundry stakes: Samsung and Intel seek strategic overhaul under TSMC's shadow
Regardless of Samsung and Intel's third-quarter earnings, the real story isn't in comparing them to TSMC. What's critical now is each company's internal recalibration and its leadership's...
Thursday 31 October 2024
Samsung, SK Hynix, Intel put packaging at the heart of future innovation
At SEDEX 2024 in Seoul, Samsung Electronics, SK Hynix, and Intel showcased advanced packaging technologies as essential for future semiconductor innovations. With a focus on AI and...
Thursday 31 October 2024
UMC sees falling fab utilization and gross margin in 4Q24
Pure-play foundry United Microelectronics (UMC) anticipates a decline in both its fab utilization rate and gross margin in the fourth quarter of 2024, and has lowered its capital...
Wednesday 30 October 2024
TSMC reportedly halts supply to two suspected Huawei proxies, challenges from China’s intermediary networks persist
According to informed sources, TSMC has suspended supplies to at least two chip developers due to suspicions that these companies are attempting to circumvent the US government's...
Wednesday 30 October 2024
Intel foundry: to split or not? Insights from Gelsinger and insiders
In March 2022, Intel CEO Pat Gelsinger was a guest at President Biden's State of the Union address, highlighting Intel's pivotal role in revitalizing semiconductor manufacturing in...
Wednesday 30 October 2024
Global CoWoS and CoWoS-like packaging capacity demand to surge 113% on year in 2025, says DIGITIMES Research
Global demand for Chip-on-Wafer-on-Substrate (CoWoS) and CoWoS-like packaging capacity will likely grow by 113% annually in 2025, driven by robust demand for cloud AI accelerators,...
Wednesday 30 October 2024
Trump and Vance sing a different tune on Taiwan chips ahead of US election
As the US presidential election approaches, Republican candidate Donald Trump and running mate JD Vance have expressed markedly different views on Taiwan's semiconductor industry,...
Wednesday 30 October 2024
Infineon unveils ultra-thin 20-micrometer power semiconductor wafer
Infineon Technologies has disclosed its latest milestone in semiconductor manufacturing technology, following the announcement of the world's first 300-millimeter GaN power wafer...
Wednesday 30 October 2024
Samsung set to introduce high-NA EUV equipment by early 2025
Samsung Electronics is reportedly preparing to introduce its first High-NA EUV (extreme ultraviolet lithography) equipment in early 2025, signaling a major advancement for the South...
Wednesday 30 October 2024
Samsung enters the SiPh race with I-Cube So/Eo, challenging TSMC and China's rising stars
Samsung Electronics and TSMC are ramping up the development of SiPh technology to handle the exponential data growth driven by AI applications. The Seoul Economic Daily reports...
Wednesday 30 October 2024
Glass substrates poised to transform advanced packaging: Q&A with Corning commercial technology director Xavier Lafosse
The rapid development of AI has dramatically increased demand for AI chips, but current organic substrate technology faces challenges, including thermal expansion mismatches and warping,...
Colder Products Company
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research