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Monday 2 December 2024
Intel balances US subsidies with renewed China commitment
On November 26, Intel Connection China, hosted in Chengdu, emerged as the company's largest technology ecosystem event to date, featuring participation from major partners including...
Friday 29 November 2024
German government plans about EUR2 Billion in new chip subsidies
The German government is preparing billions of euros of new investments into the nation's semiconductor industry, two months after Intel Corp. href="https://www.bloomberg.com/news/articles/2024-09-17/germany-faces-fresh-setback-as-intel-halts-planned-chip-factory"...
Friday 29 November 2024
Samsung's semiconductor personnel reform appears unconventional but may still struggle with bureaucracy
Samsung Electronics is undergoing a personnel reform in response to the crisis within its semiconductor business. Notably, the head of Device Solutions (DS), Young-Hyun Jun, will...
Friday 29 November 2024
Samsung Foundry's uncertain future: What path should it take?
Amid challenges, Samsung has decided to scale back investments in its foundry business, prioritizing existing production lines to reduce losses and refocusing efforts on regaining...
Friday 29 November 2024
Qualcomm-Intel deal speculation fizzles out
Qualcomm is unlikely to pursue any transactions with Intel, a decision that aligns with industry expectations. Sources close to the semiconductor supply chain suggest Qualcomm never...
Friday 29 November 2024
PSMC advances with western PMIC growth and 3D AI foundry debut
Powerchip Semiconductor Manufacturing Corporation (PSMC) announced on November 28 the launch of its Tongluo facility in Miaoli, central Taiwan, equipped with advanced interposer production...
Friday 29 November 2024
Japan doubles down on semiconductor subsidies, Rapidus poised for more support
The Japanese government is preparing a budget amendment for fiscal year 2024 (April 2024 – March 2025) to allocate additional support for the semiconductor and AI sectors, with...
Friday 29 November 2024
China's semiconductor industry makes significant strides, putting pressure on South Korean firms
China's largest foundry operator, SMIC, surpassed the US$2 billion revenue mark for the first time in the third quarter of 2024. Meanwhile, companies like CXMT and JHICC are aggressively...
Friday 29 November 2024
Micron targets Samsung's home turf with 'on-the-spot hiring' to attract talent
Micron has intensified its recruitment efforts in South Korea, targeting university campuses with "on-the-spot hiring" initiatives. Previously focused on hiring experienced engineers...
Thursday 28 November 2024
Lam Research to set up office at Tata-PSMC wafer fab
Taiwan-based pure-play foundry PSMC is building a 12-inch wafer fab for Tata Electronics in India, and Lam Research, eyeing growing Indian opportunities, plans to set up an office...
Thursday 28 November 2024
TSMC donates more 12-inch fab equipment to Taiwan govt
Following a previous donation of two sets of 12-inch wafer equipment to Taiwan's National Science and Technology Council (NSTC), TSMC has donated an additional three sets to the Ministry...
Thursday 28 November 2024
IDMs develop automotive chips tailored for China market
International integrated device manufacturers (IDMs) have begun offering automotive-grade chips specifically designed for the China market in 2024, responding to mounting cost pressures...
Thursday 28 November 2024
Taiwan-made DUV photoresist likely to complete terminal production line verification by end of 2024
Although the US and Dutch governments have banned ASML from selling extreme ultraviolet (EUV) and advanced deep ultraviolet (DUV) lithography equipment to China, sales and after-sales...
Thursday 28 November 2024
Funding cuts, layoffs, and reorganization common in China's competitive chip industry
In 2024, major Chinese semiconductor businesses continue to announce closures or severe layoffs, according to industry sources. Xiangdixian Computing Technology, commonly referred...
Thursday 28 November 2024
Equipment supplier gives hints at FOPLP development progress among Taiwanese companies
Fan-out panel level packaging (FOPLP) is a promising semiconductor technology that has been attracting investments from Taiwan's supply chains, including IC foundries, OSATs, panel...
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research