Regardless of Samsung and Intel's third-quarter earnings, the real story isn't in comparing them to TSMC. What's critical now is each company's internal recalibration and its leadership's...
At SEDEX 2024 in Seoul, Samsung Electronics, SK Hynix, and Intel showcased advanced packaging technologies as essential for future semiconductor innovations. With a focus on AI and...
Pure-play foundry United Microelectronics (UMC) anticipates a decline in both its fab utilization rate and gross margin in the fourth quarter of 2024, and has lowered its capital...
According to informed sources, TSMC has suspended supplies to at least two chip developers due to suspicions that these companies are attempting to circumvent the US government's...
In March 2022, Intel CEO Pat Gelsinger was a guest at President Biden's State of the Union address, highlighting Intel's pivotal role in revitalizing semiconductor manufacturing in...
Global demand for Chip-on-Wafer-on-Substrate (CoWoS) and CoWoS-like packaging capacity will likely grow by 113% annually in 2025, driven by robust demand for cloud AI accelerators,...
As the US presidential election approaches, Republican candidate Donald Trump and running mate JD Vance have expressed markedly different views on Taiwan's semiconductor industry,...
Infineon Technologies has disclosed its latest milestone in semiconductor manufacturing technology, following the announcement of the world's first 300-millimeter GaN power wafer...
Samsung Electronics is reportedly preparing to introduce its first High-NA EUV (extreme ultraviolet lithography) equipment in early 2025, signaling a major advancement for the South...
Samsung Electronics and TSMC are ramping up the development of SiPh technology to handle the exponential data growth driven by AI applications. The Seoul Economic Daily reports...
The rapid development of AI has dramatically increased demand for AI chips, but current organic substrate technology faces challenges, including thermal expansion mismatches and warping,...
Nikon has announced plans to launch exposure equipment for the back-end semiconductor process in fiscal year 2026 (April 2026 to March 2027), utilizing a photomask-free approach,...
Hon Precision, Inc. (HPI), based in Taiwan, will be listed on the Emerging Stock Board (ESB) on October 31. The company, which specializes in backend semiconductor test handlers and...
On October 26th, the TSMC "family" gathered for its annual sports day, with founder Morris Chang calling it his favorite day of the year. Hosting for the first time, Chairman C.C...
OpenAI is working with Broadcom Inc. to develop a new artificial intelligence chip specifically focused on running AI models after they've been trained, according to two people familiar...
