China's smartphone application processor (AP) shipments returned to the traditional off-season pattern in the second quarter of 2024, with a slight quarter-on-quarter increase of...
Semiconductor materials supplier Topco Scientific is keenly promoting the use of new materials for CoWoS and other advanced packaging technologies, confident in its operations and...
On August 15, Applied Materials held an earnings call, noting that Intel's planned reduction in capital expenditures is expected to have minimal impact on the company. Applied Materials...
Packaging firm Xintec Technology is optimistic about upcoming demand for 3D sensing components packaging and 12-inch wafer testing in the third quarter, the traditional peak season...
Applied Materials reported growth across all segments, driven by AI-fueled demand and advancements in semiconductors, including gate-all-around (GAA), high-bandwidth memory, and advanced...
TSMC has acquired Innolux's 5.5G LCD fab in Tainan, southern Taiwan, for NT$17.14 billion (US$530.8 million). The acquisition price is less than what the market had anticipated.
The just acquired 5.5G panel fab would enable TSMC to boost its overall production capacity for CoWoS packaging to 60,000 wafers per month in 2025, with a projected increase to 70,000-80,000...
Taiwan aims for annual economic growth of 2.8%-3.6% for the next four years, with the government aiming to lift the tech titan's overall output to around $1 trillion over that peri...
DIGITIMES Research released a special report on AI chips on August 14, highlighting the rapid development of the semiconductor market driven by generative AI.
China's self-sufficiency push for ICs has limited the ability of multinational automotive IC integrated device manufacturers (IDM) and fabless chipmakers to secure orders from the...
The 2024 International Semiconductor Exhibition (SEMICON Taiwan) is set to launch on September 4, focusing on semiconductor technologies crucial to the emerging AI era.
