SK Hynix held a press conference on May 2 at its headquarters in Icheon, Gyeonggi Province, to reveal details of its investment plans for the M15X fab in Cheongju and the Yongin Semiconductor...
Taiwan-based Vanguard International Semiconductor (VIS) has reported first-quarter 2024 results that were somewhat better than expected. While facing market pricing competition from...
In the first quarter of 2024, Samsung Electronics successfully turned a profit in its semiconductor business due to increased demand for AI-related memory. Coupled with the sales...
Many Chinese semiconductor firms have told customers they are raising prices due to rising costs of precious metals, such as gold and copper, according to industry sources.
With Nvidia continuing to make waves in the market, the gap between companies attempting to catch up with them in the cloud AI arena continues to widen.
Taiwan's economy expanded at the fastest pace in almost three years as global demand for artificial intelligence-related technologies fueled a boom in exports.
Samsung Electronics has reported operating profits of KRW6.61 trillion (US$4.78 billion) on consolidated revenue of KRW71.92 trillion for the first quarter of 2024. Revenue was primarily...
Samsung Electronics has been ramping up its power semiconductor development team and is considering expanding its production capacity. This move aims to meet the anticipated surge...
Notebook production in Vietnam has increased dramatically, making the country the second largest source of imports to the US behind China, according to government sources.
The Times of India, citing senior officials in the Indian government, said that India is considering launching a new multi-billion-dollar incentive package for semiconductor...
NXP experienced a slower automotive market and increased demand for industrial and mobile segments. The chipmaker gave a better outlook for the second quarter.
Innolux signed an agreement with Japan-based Tech Extension Co. (TEX) and Tech Extension Taiwan Co. (TEX-T) to introduce next-generation 3D packaging technologies based on Bumpless...