Taiwan-based IC substrate specialists Unimicron Technology, Nan Ya PCB, and Kinsus Interconnect Technology are poised to generate sequential revenue increases in the fourth quarter...
Taiwan's PCB equipment makers remain optimistic about demand prospects despite orders deferral at the request of some customers, with most of them ending the first months of the year...
Taiwan's three major IC substrate suppliers Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology have all posted record revenues for the third quarter of 2022, bolstered...
PCB materials supplier Eternal Materials remains cautious about its sales prospects in the third quarter of 2022, citing the ongoing inventory adjustments across the supply chains...
Taiwan's PCB equipment makers are all optimistic about their shipments for the second half of the year, as they are busy fulfilling orders mainly from IC substrate makers to support...
Aggregate first-half 2022 revenues of Taiwan's PCB manufacturers surged 18% on year to NT$419.7 billion (US$13.256 billion), due mainly to strong shipments of IC substrates that have...
Market observers are generally optimistic about the IC substrate and automotive PCB market prospects in the long term, with both product segments to become major growth drivers for...
Nan Ya PCB is looking to grow its automotive IC substrate sales as a proportion of company revenue to over 10% in 2022, up from 7-8% in 2021, according to company sources.
Apple has become a bellwether in the HPC chip segment by rolling out its high-performance M1 series built using advanced process at its foundry partner, but all other manufacturing...
An extended COVID lockdown in Kunshan, China is not much constraining PCB and IC substrate supply from plants there operated by Taiwan-based makers Unimicron Technology and Nan Ya...
Taiwan's leading PCB specialist Zhen Ding Technology is gearing up to carry out its ambitious 10-year development roadmaps for IC substrates, aiming to rank among the world's top-5...
Apple has just unveiled its M1 Ultra SoC built using in-house-developed UltraFusion packaging architecture, which will be fabricated by TSMC with a 5nm process node and advanced packaging...