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Tuesday 23 July 2019
Compal eyeing opportunities from edge computing
Compal Electronics' server team has shifted its operation focus from cloud to edge computing, and is vying for orders for edge computing servers from China's top-3 telecom carriers,...
Tuesday 23 July 2019
Covestro developing material solutions for 5G devices
Polymer and high-tech materials supplier Covestro is developing innovative material solutions for 5G devices, such as base stations, active antenna units and other equipment, according...
Monday 22 July 2019
China PCB maker Shennan Circuits sees 1H19 profits soar
China's leading PCB maker Shennan Circuits (SCC) has estimated its net earnings for the first half of 2019 at CNY420-470 million (US$61.06-68.33 million) for an annual growth of 50-70%,...
Monday 22 July 2019
TSMC steps up investment in EUV processes
Pure-play foundry Taiwan Semiconductor Manufacturing Company (TSMC) is stepping up the construction of its new factory site in Tainan, southern Taiwan, while its application to set...
Friday 12 July 2019
Tripod sees record 2Q19 revenues
Taiwan-based PCB maker Tripod Technology saw its revenues grow slightly from a year ago to reach a record high in the second quarter of 2019 and expects the momentum to continue in...
Wednesday 10 July 2019
Sporton, Qualcomm team up to gain FCC approval for 802.11ay solution
Mobile device testing and certification service company Sporton International has teamed up with Qualcomm to gain US Federal Communications Commission (FCC) approval for 60GHz Wi-Fi...
Monday 1 July 2019
IntelliEPI 2019 revenues rise 10-20% on robust demand for GaAs, InP epi-wafers
Taiwan-based Intelligent Expiataxy Technology (IntelliEPI) expects its revenues for 2019 to rise 10-20% on year on growing demand for GaAs and InP-based epi wafers to support 5G infrastructure...
Tuesday 11 June 2019
Huawei demand for 5G infrastructure materials may drop slightly due to redesign
Huawei may slow slightly down its pace of pulling in shipments of PCBs and related materials for 5G base stations in the short term as the company is redesigning circuit layouts to...
Tuesday 11 June 2019
New IC supply chain may loom in Asia for China tech sector
A new supply chain for China IT firms may gradually take shape in Asia in the future as they are seeking to wean themselves off US suppliers of crucial components and facilitate their...
Thursday 6 June 2019
Microsoft and Oracle to interconnect Azure and Oracle Cloud
Microsoft and Oracle has announced a cloud interoperability partnership enabling customers to migrate and run mission-critical enterprise workloads across Microsoft Azure and Oracle...
Wednesday 5 June 2019
Unimicron, Kinsus to expand additional ABF substrate capacities
Unimicron Technology and Kinsus Interconnect Technology both have plans to expand additional new capacities for ABF (ajinomoto build-up film) substrates judging from robust demand...
Monday 3 June 2019
Wi-Fi 6 outlook: Q&A with Cees Links from Qorvo
Along with Skyworks and Broadcom as the world's top-3 providers of RF (radio frequency) solutions for advanced wireless devices, US-based Qorvo is keen on promoting Wi-Fi 6 (IEEE...
Wednesday 22 May 2019
Taiwan CCL makers racing to gain presence in 5G infrastructure market
Despite US trade sanctions against Huawei likely to slow the installation progress of 5G base stations in China, Taiwan's CCL (copper clad laminate) suppliers are still actively rolling...
Monday 29 April 2019
TSMC expands OIP cloud alliance
TSMC has announced the expansion of its open innovation platform (OIP) cloud alliance, with Mentor Graphics joining inaugural members Amazon Web Services (AWS), Cadence, Microsoft...
Tuesday 16 April 2019
Samsung announces 5nm EUV development
Samsung Electronics has announced that its 5nm FinFET process technology is complete in its development and is ready for customers' samples.