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Friday 31 July 2026
AI server boom reshapes MLCC pricing as capacity shifts upmarket

The rapid expansion of AI infrastructure is reshaping one of the semiconductor industry's most overlooked component markets. Soaring...

Friday 31 July 2026
CHPT raises 2026 capex to NT$500M

Test interface maker Chunghwa Precision Test Tech (CHPT) held an investors' conference on July 29, saying revenue growth in the second...

Friday 31 July 2026
Delta Electronics raises 2026 capex to NT$70B, sees AI-related sales topping 25% of total

Delta Electronics expects capital spending to rise to roughly NT$70 billion in 2026 from NT$46.1 billion in 2025, driven by growing...

Friday 31 July 2026
Apple targets AI subscription revenue as Cook exits and Ternus inherits next growth strategy
Apple is positioning AI as the foundation of its next growth phase, combining a privacy-focused AI strategy with expanded US semiconductor sourcing to support future products and services...
Friday 31 July 2026
Apple braces for "hundred-year flood" in component costs
Apple's June quarter showed the strength of its core hardware business. Still, it also exposed a looming challenge: rising memory prices, tight supply of advanced chips, and heavier...
Friday 31 July 2026
Amazon's accelerating cloud growth reinforces AI investment case despite heavier spending outlook
Amazon reported stronger-than-expected second-quarter results as accelerating growth at its cloud computing business underscored rising demand for artificial intelligence services...
Friday 31 July 2026
Apple beats quarterly estimates, but softer outlook and supply constraints temper optimism
Apple reported stronger-than-expected fiscal third-quarter results, driven by robust iPhone and Mac demand, but warned that supply constraints and rising memory costs would weigh on...
Friday 31 July 2026
WAIC 2026 unveils AIDV shift as physical AI gains ground
DIGITIMES Intelligence said its observations at the 2026 World Artificial Intelligence Conference (WAIC) show the automotive industry's transformation moving from software-defined...
Friday 31 July 2026
SPIL AI packaging investment boosts CTSP Erlin Park as first standard factory opens in 2H26
The Central Taiwan Science Park's (CTSP) Erlin Park is set to reach a long-awaited milestone when its first standard factory building begins operations in the second half of 2026,...
Friday 31 July 2026
ams OSRAM's Micro LED links trade speed for scale in AI data centres

ams OSRAM is developing Micro LED-based optical data links for AI data centres, positioning the technology as a high-density, scalable...

Friday 31 July 2026
TAIONE foundation launches with NT$300 million to build Taiwan's open source AI push
The TAIONE Open Source Foundation was officially launched on the 30th and said it will deploy NT$300 million in private-sector resources over the next three years to advance open-source...
Friday 31 July 2026
US manufacturing push draws Taiwan suppliers; electronics investment up nearly 500%

TSMC chairman C.C. Wei has announced an additional US$100 billion investment for building capacity in the US, on top of the company's...

Friday 31 July 2026
Qualcomm, MediaTek set Sept flagship SoC showdown
Qualcomm and MediaTek are preparing to unveil their latest 2nm flagship smartphone system-on-chip (SoC) platforms in September 2026, with both brands expected to launch standard and...
Friday 31 July 2026
Coretronic drone unit shifts to four fronts amid procurement delay
Coretronic said its robotics subsidiary, Coretronic Intelligent Robotics (CIRC), is focusing on four development priorities as a large domestic government drone procurement plan remains...
Friday 31 July 2026
CSCC develops SiC crucibles to strengthen Taiwan’s AI data center supply chain
China Steel Corporation affiliate CSCC has developed 6N high-purity isotropic graphite blocks for 8-inch and 12-inch silicon carbide (SiC) crystal growth crucibles, aiming to reduce...