Global NAND flash makers are on track to start a new round of competition in producing 3D NAND chips with over 200 layers after Micron Technology announced commercial production of...
Kioxia has introduced an industrial-grade series of its 3D flash memory BiCS FLASH. Sampling commenced earlier this year, with mass production expected late in the fourth quarter...
Datacenter and corporate clients have recently moved to adjust their NAND flash inventory in response to component shortages and global economic downturns, although demand for SSD...
SK Hynix has announced the development of its 238-layer 4D NAND flash memory, with shipments of 512Gb triple-level cell (TLC) chip samples already kicking off.
Following the subsidies to TSMC's 300mm fab in Kumamoto and TSMC's 3DIC R&D center in Ibaraki, Japan's Ministry of Economy, Trade and Industry (METI) has lately announced plans...
The global smartphone memory market clocked a total revenue of US$11.5 billion in the first quarter of 2022, according to Strategy Analytics. Samsung Electronics, SK Hynix and Micron...
The 2021 peak demand for NAND flash has passed, and continued downturn in consumer applications is expected to widen price falls for such memory chips to double-digit levels in the...
NAND flash chipmaker Yangtze Memory Technologies (YMTC) plans to skip the 192-layer generation and move directly to 232 layers, according to industry sources in China.
Silicon Motion Technology will not change its trade mark or operating strategy after being acquired by US-based broadband communication chips supplier MaxLinear, as both companies...
DRAM and NAND flash spot prices are expected to continue trending downward in the second quarter of 2022, prompting channel distributors to be conservative and to offload their inventories...
Kioxia and Western Digital have finalized a formal agreement to jointly invest in the first phase of the Fab7 (Y7) manufacturing facility at Kioxia's Yokkaichi plant in Japan's Mie...
Powertech Technology (PTI) has obtained orders for packaging MediaTek's smartphone application processors slated for launch later in 2022, under the chipmaker's strategy to diversify...
Kioxia has started sampling its new UFS Ver. 3.1 embedded flash memory devices for automotive, according to the company. The new lineup utilizes Kioxia's cutting-edge BiCS FLASH 3D...
