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NEWS TAGGED LAMINATE
Friday 15 June 2018
Ventec to apply for listing on TWSE mainboard
Copper clad laminate (CCL) supplier Ventec International plans to apply for listing on the Taiwan Stock Exchange (TWSE) mainboard in the first quarter of 2019, according to company...
Friday 20 April 2018
Global semiconductor packaging materials market reaches US$16.7 billion in 2017
The global semiconductor packaging materials market reached US$16.7 billion in 2017, according to a report by SEMI and TechSearch International. While slower growth of smartphones...
Friday 12 December 2014
China market: FCCL prices under pressure to drop
Prices of copper-clad laminates (FCCL) in China are set to fall in 2015 amid increasing competition, according to industry sources.
Friday 2 August 2013
FCCL makers optimistic about 2H13
Flexible copper-clad laminate (FCCL) demand is expected to see a seasonal pick-up in the third quarter thanks to new product roll-outs and continued growth in China's smartphone market,...
Monday 1 July 2013
Rising high-Tg laminate shipments buoy gross margin for TUC
Taiwan Union Technology (TUC) has enjoyed a ramp-up in shipments of high-margin CCLs for use in servers and 4G LTE base stations since April, which will buoy its gross margin performance...
Friday 26 April 2013
CCL makers 2Q13 sales to rise
Copper-clad laminate (CCL) manufacturers Elite Materials (EMC) and Iteq both expect to post sequential revenue growth in the second quarter buoyed by strong mobile device demand,...
Tuesday 29 January 2013
FCCL firm ThinFlex expects tablet demand to drive company growth in 2013
Flexible copper-clad laminate (FCCL) maker ThinFlex expects brisk demand from the tablet sector to drive its revenue growth in 2013, although revenues for the first quarter of the...
Tuesday 8 January 2013
Iteq, EMC new CCL plants put on hold
Copper-clad laminate (CCL) manufacturers Iteq and Elite Material (EMC) have both postponed plans to build new plants in China's inland provinces, according to the companies.
Friday 7 December 2012
FCCL suppliers expect 4Q12 sales to grow
Taiwan-based flexible copper-clad laminate makers Taiflex Scientific and ThinFlex both expect to report sequential growth in revenues for the fourth quarter of 2012 compared to flat...
Friday 16 December 2011
IC packaging materials market to reach US$25.7 billion by 2015, says SEMI
The market for semiconductor packaging materials, including thermal interface materials, is expected to reach US$22.8 billion in 2011 and grow to US$25.7 billion by 2015, according...
Friday 21 October 2011
CCL supplier Iteq posts higher profits in 3Q11
Copper-clad laminate (CCL) manufacturer Iteq has reported pre-tax profits of NT$387 million (US$12.8 billion) for the third quarter of 2011, up 20.6% sequentially. The company credited...
Thursday 21 July 2011
CCL supplier ShineMore applies for OTC listing
Copper clad laminate (CCL) maker ShineMore Technology Materials has submitted an application to list on Taiwan's over-the-counter (OTC) market, according to the company. It is currently...
Thursday 7 April 2011
Glass yarn prices to rise on Japan supply disruption
Quotes for fiber glass yarns are likely to increase in April, mainly due to failure of supplies from Japan, according to industry sources.
Friday 14 January 2011
CCL makers to post strong 1Q11
Copper-clad laminate (CCL) makers Elite Material (EMC), Iteq, Taiwan Union Technology (TUC) and Uniplus Electronics are expected to see the first-quarter of 2011 buck seasonal trends,...
Tuesday 21 December 2010
Resin laminate maker Aurona 2011 profits to be hurt by rising material costs
Taiwan-based Aurona Industries, a manufacturer of PCB-use phenolic resin laminates, expects lower gross margin and profits in 2011 compared to 2010 levels due to the soaring costs...