Nickel prices have been volatile, discouraging IC packaging material suppliers, such as leadframe makers, from taking new orders, according to industry sources.
Infinenon Technologies has recently announced plans to invest over EUR 2 billion to build a new fab for wide bandgap (WBG) semiconductors (SiC and GaN) at its manufacturing complex...
German-based automotive and power semiconductor supplier Infineon is planning to ramp up in-house production in 2022 as it expects semiconductor demand to continue to outweigh the...
Leadframe supply for IC packaging remains tight, and suppliers such as Chang Wah Technology (CWTC) have been keen to expand production capacity to satisfy strong demand for processing...
Taiwan-based OSATs will experience mixed supply of packaging materials, with molding compounds to see the worst crunch beyond ABF substrates, and wirebonding leadframes and DAF (die...
Applications of third-generation semiconductors including SiC and GaN diodes, MOSFETs and related modules are set to take off in 2022, and Taiwan's semiconductor supply chain players...
Leadframe supplier Chang Wah Technology (CWTC) remains optimistic about demand from the IC backend sector in 2022, despite market concerns about recent corrections in OSATs' capacity...
Chang Wah Technology (CWTC) expects the overall leadframe demand for IC packaging to continue outpacing supply thanks to robust growth momentum for automotive ICs, networking chips...
The supply of leadframes for chip packaging has been tight, with the visibility of orders from international IDMs for automotive and industrial applications extended to 2023, according...
OSATs including Ardentec, ASE Technology, King Yuan Electronics (KYEC) and Powertech Technology (PTI) have landed significant backend orders for automotive MCUs from Japan's Renesas...
Leadframe maker I-Chiun Precision Industry plans to further expand production capacity for another two product lines - heat spreaders and LED photocouplers - by 30% each, with the...
Supply of leadframes for wirebonding packaging has been tight and will remain so through the end of 2022, which may be compounded if China's ongoing power curbs extend into fourth-quarter...
IC packaging materials distributors continue to see strong demand for wire-bonding operations despite uncertainties facing sales of notebooks, handsets and other end-market devices...
Taiwan-based leadframe makers Shuen Der Industry (SDI) and Jih Lin Technology are optimistic about shipments for automotive power components and modules over the next two to three...
