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Thursday 14 July 2011
ChipMOS secures NT$8.4 billion syndicated loan
IC packaging and testing house ChipMOS Technologies has signed an NT$8.4 billion (US$291 million) syndicated loan agreement with a banking consortium mostly to repay part of its previous...
Friday 20 May 2011
GET to apply for joint lending of up to US$84 million
Green Energy Technology (GET), a Taiwan-based producer of solar-grade polycrystalline silicon wafers, will apply for a 5-year syndicated loan of up to US$84 million from local banks,...
Thursday 28 April 2011
Wafer firms receive loans for capacity expansions
Eversol recently received a syndicated loan from 21 financial institutions totaling NT$5 billion for its new wafer facility and equipment in Taoyuan, Taiwan.
Thursday 24 March 2011
Walton to loan Powerchip NT$300 million
Walton Advanced Engineering's board of directors has approved a proposal to lend Powerchip Technology NT$300 million (US$10 million), according to a company filing with the Taiwan...
Wednesday 2 March 2011
Powerchip approved to extend maturity of loans for six months
Taiwan's Powerchip Technology has received approval to extend the maturity of its mid- and long-term loans for six months, according to a company filing with the Taiwan Stock Exchange...
Tuesday 25 January 2011
Cando signs NT$4.8 billion syndicated loan
Cando has signed a syndicated loan with banks for NT$4.8 billion (US$164.98 million) to complete its capex goal of NT$8.5 billion for 2011 for capacity expansion.
Tuesday 25 January 2011
Aide signs US$80 million syndicated loan
Aide Solar Energy, a subsidiary under Taiwan's Panjit Group, announced on January 24 that they have received a three-year US$80 million syndicated loan from 12 banks. The purpose...
Wednesday 19 January 2011
Cando 2011 capex to reach NT$8.5 billion
Cando's capex for 2011 is expected to reach NT$8.5 billion (US$293.16 million), all for capacity expansion. Cando has NT$3.6 billion available and will sign a syndicated loan for...
Tuesday 18 January 2011
Etron obtains NT$2 billion syndicated loan
Specialty DRAM design house Etron Technology on January 17 signed a five-year, NT$2 billion (US$69 million) syndicated loan provided by five banks to repay part of its previous loans...
Thursday 30 December 2010
BOE signs loan of CNY10.5 billion for 8.5G plant
China-based BOE Technology has announced that its subsidiary Beijing BOE Display Technology has signed a syndicated loan of CNY10.5 billion (US$1.59 billion) for its 8.5G TFT-LCD...
Tuesday 28 December 2010
Nanya gains additional loans from affiliates, says paper
DRAM maker Nanya Technology has secured a total of NT$17 billion (US$577 million) in loans from Formosa Plastics and Nan Ya Plastics, two affiliates of its parent company Formosa...
Thursday 23 December 2010
Compeq secures NT$5 billion syndicated loan
Compeq Manufacturing, a major Taiwan-based PCB supplier, on December 22 announced it has completed a syndicated loan of NT$5 billion (US$167 million) with a 19-member banking consortium...
Wednesday 22 December 2010
AUO to sign NT$40 billion syndicated loan by the end of 2010, says report
AU Optronics (AUO) plans to sign a syndicated bank loan of NT$40 billion (US$1.34 billion) by the end of 2010, according to a Chinese-language report in the Economic Daily News...
Tuesday 14 December 2010
Inductor maker Chilisin secures NT$2.4 billion syndicated loan
Chilisin Electronics has signed a 5-year NT$2.4 billion (US$80 million) syndicated loan agreement with a banking consortium. The new funds will be used to expand capacity for the...
Tuesday 7 December 2010
BenQ Materials receives NT$3 billion syndicated loan
BenQ Materials has signed a 5-year NT$3 billion (US$99.568 million) syndicated loan with 14 banks to shore up its operating capital. The company registered NT$1.343 billion in revenues...