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NEWS TAGGED MATERIALS

Friday 13 February 2026

Quanta boosts Thailand investment to expand AI server capacity

Quanta Cloud Technology (QCT) said it will invest THB1.098 billion (approx. US$35.34 million) in electromechanical engineering and materials for its Thailand facility, reinforcing...

Friday 13 February 2026

E-glass capacity cuts trigger production shifts for Taiwan CCL makers

The global AI data center boom is straining not only high-end computing chips but also adjacent industries such as memory and upstream glass fiber cloth, where significant capacity...

Thursday 12 February 2026

Column: USA Rare Earth acquisition of UK's LCM marks milestone in Western rare earth autonomy

Rare earth metals are essential to modern industry and defense. They are found in high-performance motors, precision weapon guidance systems, and a range of green energy technologies...

Wednesday 11 February 2026

South Korean IC designers face year-long packaging delays

Surging demand for artificial intelligence servers and high-performance computing (HPC) has tightened capacity across the semiconductor supply chain. For many small South Korean communications...

Wednesday 11 February 2026

Nam Liong says order visibility extends in 3Q25 as advanced materials enter trial ramp-up

Nam Liong Global said its overall order visibility has extended through the third quarter of 2026, with advanced materials for the electronics technology industry clearing customer...

Wednesday 11 February 2026

AI demand pushes Taiwan's Topco Scientific to record January revenue

Taiwanese semiconductor materials distributor Topco Scientific (TSC) reported record revenue for January 2026, buoyed by robust demand...

Monday 9 February 2026

India's semiconductor push shifts focus under ISM 2.0 from fabs to design, equipment and IP

According to The Economic Times, India's Electronics and IT Minister Ashwini Vaishnaw said India Semiconductor Mission (ISM) 2.0 will prioritise chip design companies and...

Monday 9 February 2026

TSMC supports Japan's advanced packaging plant construction

TSMC chairman C.C. Wei recently visited Japan and appeared alongside Prime Minister Sanae Takaichi to jointly announce that Kumamoto Fab 2 will be upgraded from a 6nm to a 3nm process,...

Friday 6 February 2026

APE 2026 Singapore: Opto Precision highlights smart glass modules with Taiwan supply chain

The smart glasses market drew attention at the third Asia Photonics Expo (APE 2026), where Singapore-based Opto Precision showcased smart glasses module solutions that integrate artificial...

Friday 6 February 2026

Commentary: Why TSMC is upgrading Japan's Kumamoto fab from 6nm to 3nm

TSMC has made a significant change in its process plan for the Kumamoto second fab, confirming an upgrade from the initially planned 6/7nm node to 3nm. This facility will become Japan's...

Friday 6 February 2026

ASE expects advanced packaging and testing revenue to double in 2026

OSAT leader ASE Technology Holding is optimistic that its growth momentum will extend through 2026 and beyond, benefiting from the short supply of advanced packaging and testing capacity...

Friday 6 February 2026

Ventec sees surge in aerospace orders, posts strongest revenue in two years

Ventec, a specialized manufacturer of copper-clad laminates (CCL), reported that consolidated revenue for January 2026 surpassed NT$400...

Friday 6 February 2026

Nittobo targets 2028 launch for next-generation glass fiber cloth

Nitto Boseki (Nittobo), which currently holds around 90% market share in the semiconductor materials glass fiber cloth segment, is planning to launch its next-generation T-glass glass...

Thursday 5 February 2026

Packaging costs rise as Chinese MCU makers push price hikes despite weak demand

Amid rising wafer fab and raw material costs, Chinese MCU maker Cmsemicon led a 15-50% price increase to curb losses in the sluggish MCU market. Despite packaging firms signaling price...

Thursday 5 February 2026

AEMC joint venture to build semiconductor adhesives R&D center in Southern Taiwan Science Park

Shin Bao Hong Technology (transliteration), a joint venture backed by three Taiwanese firms: Advanced Echem Materials (AEMC), Nan Pao...

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BIZ FOCUS

Feb 9, 08:00

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook