As AI chip package sizes continue to grow, warpage issues in IC substrates have become more pronounced. Capacity constraints for low-CTE...

As tensions between China and Japan escalate over export controls on rare earths and semiconductor materials, China is accelerating efforts...

As next-generation AI server platforms enter volume deployment, supply chain constraints are extending beyond high-bandwidth memory (HBM)...

Demand for AI chips is expected to remain strong in 2026, keeping the spotlight firmly on persistent shortages of high-end glass fiber...

Canon said on January 13 that it has developed a new wafer planarization technology designed to uniformly smooth surface irregularities...