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    Saturday 30 May 2026
    Google-backed robot startup tests E Ink electronic paper for humanoid skin
    The humanoid robotics industry is looking beyond mechanical structures for its next wave of innovation, with materials emerging as a potential focus for new market opportunities. A...
    Friday 29 May 2026
    Intel's foundry comeback hinges on advanced packaging
    Intel is reportedly making a major push into advanced semiconductor packaging as it seeks to strengthen its foundry business and expand capacity for its Embedded Multi-die Interconnect...
    Friday 29 May 2026
    Shinkong Synthetic Fibers outlines AI and semiconductor growth plans amid market volatility
    Shinkong Synthetic Fibers Corp. said at its May 28 shareholders meeting that it will pursue expansion in AI, semiconductor chemicals, and eco-friendly notebook materials as it navigates...
    Friday 29 May 2026
    Export controls cast a shadow over AI's optical communications supply chain
    The Taiwanese semiconductor materials company Visual Photonics Epitaxy, a supplier of compound semiconductor wafers used in optical communications, said demand tied to artificial intelligence...
    Thursday 28 May 2026
    Iteq sees AI data center demand lift M7+ CCL shipments
    Copper clad laminate (CCL) maker Iteq held its 2026 annual general meeting on Thursday, with Chairman Dennis Chen saying that the continued deepening of generative AI applications,...
    Thursday 28 May 2026
    Formosa Chemicals maps turnaround through hydrogen, AI, and semiconductor materials
    Formosa Chemicals & Fibre Corporation said it is accelerating restructuring and diversification efforts after posting losses in 2025, as the petrochemical major pivots toward higher-value...
    Thursday 28 May 2026
    Formosa Chemicals to showcase low-carbon 5N5 hydrogen and semiconductor materials at COMPUTEX 2026
    Formosa Chemicals & Fibre Corporation announced it will debut at COMPUTEX 2026 next week to present a push into semiconductor-grade materials and low-carbon hydrogen supply aimed...
    Wednesday 27 May 2026
    Taiwan's Wah Lee expands into specialty gases as materials costs are passed on quarterly
    Wah Lee Industrial said it has formally moved into investments in standard gases and other supplies needed by wafer fabs, with its Tainan logistics center set to open in the second...
    Wednesday 27 May 2026
    Daxin Materials advances into Low Dk and Low Df market for booming AI server and LEO satellite applications
    Taiwan-based Daxin Materials posted stronger revenue and profitability in 2025 as rapid growth in semiconductor materials offset a still-cautious display market recovery, with AI-...
    Wednesday 27 May 2026
    Copper crunch hits components cost amid AI demand surge
    Tight upstream copper concentrate supply has kept prices high despite rising exchange inventories, squeezing margins for electronics companies and prompting suppliers to pass costs...
    Wednesday 27 May 2026
    Covestro highlights material solutions for AI data centers and embodied intelligence at COMPUTEX 2026
    Covestro showcased a portfolio of engineering plastics and thermoplastic polyurethane materials at COMPUTEX 2026 aimed at supporting AI computing, embodied intelligence, and networking...
    Wednesday 27 May 2026
    Taiwan optoelectronics materials maker Wah Hong targets high-end PCB and chip packaging demand

    AI, low-carbon sustainability, smart cities, and advanced displays are set to drive the global optoelectronics industry in 2026, shifting...

    Tuesday 26 May 2026
    E Ink brings BMW-backed color-changing e-paper car tech to Computex 2026

    E Ink will bring its BMW-backed color-changing e-paper vehicle technology to Computex 2026, showcasing the hood structure of the BMW iX3...

    Tuesday 26 May 2026
    NTT updates tsuzumi 2 to read charts and boost numerical reasoning
    NTT updated its lightweight Japanese large language model, tsuzumi 2, to better understand charts, graphs, and other visuals in business documents, thereby strengthening numerical...
    Monday 25 May 2026
    Lam Research CEO: New fabs alone will not solve chip bottlenecks
    Lam Research CEO Tim Archer said artificial intelligence and robotics can help chipmakers improve fab productivity as the semiconductor industry faces memory capacity constraints,...
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    BIZ FOCUS
    Apr 28, 08:00
    AI anti-fraud solution wins virtual asset security hackathon
    Monday 27 April 2026
    SK hynix receives 2026 IEEE Corporate Innovation Award
    Monday 27 April 2026
    Anti-fraud hackathon winner showcases multi-dimensional tech-nology framework
    Friday 24 April 2026
    NewPower Named HPE 2026 Partner of the Year
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook