Semiconductor packaging and testing materials distributor Niching Industrial hosted an investor conference on September 17. chief financial...
Advanced packaging remains one of the semiconductor industry's hottest technology areas in 2026. In Taiwan, terms such as co-packaged...
Copper-clad laminate (CCL) manufacturer Ventec International Group has approved an expansion budget of NT$1.5 billion (approx. US$47.11...
As the industry shifts toward greater use of optical interconnects and less reliance on copper, market speculation has emerged that...
Micron held a conference for Taiwanese suppliers on September 17 under the theme of building at speed and growing at scale. The event...
The spotlight has been on industry innovation at the 2026 Taipei International Plastics and Rubber Industry Show (TaipeiPLAS), as Taiwan's...
Nan Ya Plastics is speeding up its transformation in electronic materials as cloud service providers expand capex at a rapid pace, making...
Foxconn Interconnect Technology (FIT), a subsidiary of Foxconn, held FIT Tech Day 2026 on September 16 under the theme "Light at Scale:...
Japanese semiconductor materials leader Tokyo Ohka Kogyo (TOK) held a completion ceremony on September 15, 2026, for a new KRW101 billion...
