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NEWS TAGGED MEMORY
Friday 15 November 2024
Adata continues dumping inventories until year-end
Memory module manufacturer Adata Technology anticipates memory contract prices will stay stable or see slight declines in the fourth quarter of 2024, with the company continuing to...
Thursday 7 November 2024
Transcend expects 4Q24 spot memory price drops to stabilize
The memory module industry faces significant challenges in the fourth quarter of 2024, with Transcend Information experiencing substantial inventory depreciation losses amid plummeting...
Wednesday 6 November 2024
AP Memory seeks to capitalize on robust HPC and AI chip demand
Memory intellectual property (IP) firm AP Memory Technology has seen AI drive an uptick in sales, even as its IoT business has yet to rebound. With quarterly gross margin back on...
Monday 4 November 2024
SK Hynix CEO unveils world's first 16-high HBM3E at SK AI Summit 2024
SK Hynix plans to provide samples of its 48GB, 16-layer HBM product—the industry's largest capacity and highest layer count—in the first quarter of 2025. CEO Noh-Jung...
Monday 4 November 2024
Samsung plans 400+ layer NAND and cutting-edge DRAM for 2026 to reclaim AI memory market
Samsung Electronics is reportedly set to launch high-capacity and high-heat-dissipation Bonding Vertical (BV) NAND Flash with more than 400 layers in 2026. This move aims to enhance...
Tuesday 29 October 2024
Memory manufacturers maintain price floor as server contract prices rise in 4Q
With the demand for memory driven by AI servers, the industry initially expected contract prices to ease and decline in the fourth quarter. However, sources within the supply chain...
Monday 21 October 2024
Winbond Electronics eyes AI memory boom amid HBM demand surge
The AI surge is fueling unprecedented demand for High Bandwidth Memory (HBM), prompting Winbond Electronics to focus on tailored AI memory solutions for end applications. The company...
Monday 21 October 2024
Samsung and SK Hynix pivots to high-value memory tech to fend off China's price wars
Samsung Electronics and SK Hynix are reportedly advancing high-value-added technologies such as High Bandwidth Memory 4 (HBM4) and Compute Express Link (CXL) to maintain their dominance...
Monday 7 October 2024
DRAM, flash momentum slows: Memory packaging and testing bracing for a soft 4Q24
The sluggish recovery in memory end-market demand has led to an early slowdown in supply chain activity, impacting the operational growth of memory packaging and testing firms in...
Tuesday 1 October 2024
Memory contract price rally to slow in 4Q24
Memory contract prices are expected to continue their rally in the fourth quarter of 2024, albeit at a slower pace, according to market sources.
Tuesday 1 October 2024
SK Hynix advances 16-layer HBM3E to maintain market lead
SK Hynix is expediting the development of 16-layer HBM3E (High Bandwidth Memory) to reinforce its leading position in the competitive HBM market, as challenges from rivals like Samsung...
Friday 20 September 2024
China-based CXMT's aggressive production expansion may disrupt global DRAM market
With strong backing from the Chinese government, Changxin Memory Technologies (CXMT) is aggressively expanding its DRAM production capacity, potentially challenging the triopoly led...
Friday 13 September 2024
China's aggressive DRAM expansion alarming South Korea's memory giants
China's leading DRAM manufacturer, Changxin Memory Technologies (CXMT), is reportedly ramping up its production. This move has raised alarm in the South Korean memory industry, potentially...
Monday 2 September 2024
Peak season fails to boost 3Q24 memory spot pricing
Even though the third quarter is the traditional peak season for consumer electronics and other end-market applications, DRAM and NAND flash memory spot prices have decreased almost...
Wednesday 28 August 2024
Samsung supplies automotive LPDDR4X to Qualcomm, challenges Micron's market lead
Samsung Electronics has announced the successful qualification of its automotive LPDDR4X memory for use with Qualcomm Technologies' Snapdragon Digital Chassis. This memory is intended...
Colder Products Company
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research