Verizon and Corning have agreed to a multi-billion-dollar supply deal that could shape broadband access and artificial intelligence infrastructure well beyond the US. The pact underscores...
China is accelerating the large-scale deployment of AI computing infrastructure. On September 7, the Ministry of Industry and Information Technology (MIIT) released its 15th Five-Year...
Arm unveiled new platforms and ecosystem programs for cloud data centers, Physical AI and mobile devices on September 8, broadening its role beyond CPU intellectual property into a...
ADATA Technology said it will integrate the products, technologies and solutions of its TRUSTA and ADATA Industrial brands to target enterprise servers, edge computing, system integration,...
India's fixed wireless access (FWA) market is expanding quickly as 5G rollouts accelerate and policymakers push local manufacturing, but Taiwanese networking suppliers say the opportunity...
ByteDance and ZTE are preparing to launch the Nubia NaviX Ultra in September after the AI smartphone received China's network access approval, clearing the regulatory process from...
Huawei rotating chairman Eric Xu said at the HarmonyOS Ecosystem Conference 2026 in Shenzhen on August 28 that the HarmonyOS ecosystem now has more than 100,000 native applications,...
Global smartphone shipments are set to shrink sharply in 2026 as soaring memory and core component prices hit the market, but Samsung Electronics is moving in the opposite direction...
Global shipments of LCD TVs larger than 70 inches have climbed sharply over the past four years, with models above 98 inches rising 12-fold, according to a Nikkei report citing...
Advances in low-latency and zero-latency wireless communications are seen as a critical foundation for physical AI, remote control, virtual reality (VR), augmented reality (AR), and...
Xiaomi officially unveiled its next-generation in-house system-on-chip (SoC), the Xring O3, at its Xring Chip Technology Briefing on August 24, continuing to position the silicon as...
Samsung Electronics commercialized fan-out panel-level packaging (FOPLP) before rivals, using the technology in mobile and wearable chips and now preparing to extend it into AI and...
The Autonomous Mobile Robot Alliance (AMRA), formed by Taiwan's Industrial Technology Research Institute and industry, academia, and research partners, has released a new standard...
