Mon, Dec 6, 2021
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NEWS TAGGED NOR
Thursday 2 December 2021
Macronix to raise NOR flash prices in 1Q22
Macronix International plans to adjust upward its NOR flash chip prices by 5-10% in the first quarter of 2022, while fellow company Winbond Electronics is looking to maintain its...
Wednesday 24 November 2021
Winbond to sustain full capacity for NOR flash memory till 2022
Winbond Electronics is expected to maintain full capacity utilization through next year to fulfill NOR flash chip orders, according to industry sources.
Thursday 11 November 2021
Macronix developing 3D NOR flash
Macronix International is engaged in the development of 3D NOR flash memory in-house, which is expected to bear fruit within two years, according to company chairman Miin Wu.
Tuesday 9 November 2021
Macronix posts record October revenue
ROM and flash memory chipmaker Macronix International saw its revenue hit a record high for the seventh consecutive quarter in October 2021, while revenue at fellow flash company...
Tuesday 2 November 2021
Specialty memory maker ESMT upbeat about ASP growth in 2022
Specialty memory IC design house Elite Semiconductor Memory Technology (ESMT) expects its gross margin to stay high at above 40% in the fourth quarter of 2021, with the prospect that...
Wednesday 27 October 2021
Macronix to scale up 3D NAND flash output in 2022
Macronix International expects to scale up substantially the output of its 48-layer 3D NAND flash memory in 2022, and is upbeat about its NOR flash chip prices that will continue...
Monday 25 October 2021
Specialty DRAM, NOR flash supply to remain constrained in 2022
The supply of specialty DRAM and NOR flash memory chips will still fall short of demand in 2022, due to supply-side constraints, according to industry sources.
Friday 8 October 2021
Macronix, Phison see 3Q21 revenue hit record high
Flash memory chipmaker Macronix International saw its third-quarter revenue climb a robust 31% sequentially to NT$14.97 billion (US$535.1 million) while revenue at flash device controller...
Monday 4 October 2021
NOR flash to remain tight through 2022
The supply of NOR flash memory has been relatively tight compared to that of DRAM and NAND flash memory, and is expected to remain short of demand through 2022, according to industry...
Wednesday 8 September 2021
Adata expects DRAM spot prices to be stable in 4Q21
Memory module maker Adata Technology expects price stability to take place in the DRAM spot market starting the fourth quarter of 2021.
Monday 23 August 2021
Macronix ArmorFlash NOR Flash Earns PSA Certified Level 1 status at device level
Macronix International, a leading integrated device manufacturer in the non-volatile memory (NVM) market, has announced its ArmorFlash MX75 series NOR Flash received PSA Certified...
Wednesday 18 August 2021
Macronix to enhance 3D NAND, advanced NOR flash offerings
Macronix International will be strengthening its 3D NAND and advanced NOR flash offerings, eyeing a bigger presence in the automotive and other niche-market sectors, according to...
Monday 9 August 2021
Taiwan memory chipmakers post strong sales for July
DRAM chipmaker Nanya Technology saw its revenue reach a 34-month high of NT$7.95 billion (US$285.6 million) in July 2021, while specialty DRAM and flash chipmaker Winbond Electronics'...
Monday 2 August 2021
Macronix gearing up for ROM output ramp-up
Macronix International is gearing up for a substantial ramp-up in shipments of its ROM memory chips starting the third quarter of 2021, according to company president CY Lu.
Wednesday 28 July 2021
Macronix to expand 12-inch fab capacity
Macronix International, a maker of memory chips, has disclosed plans to expand its 12-inch fab capacity for 3D NAND and NOR flash with an investment of NT$41.5 billion (US$1.48 bil...
Monday 11 June 2018
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.
Thursday 29 June 2017
Winbond NOR flash for IoT
Winbond Electronics has announced an expansion of its flash product portfolio with the introduction of its lowest-voltage SpiFlash memories to date. At 1.2 and 1.5V, and in 8-pin packages, these newest members of the SpiFlash family provide designers with serial flash memories for audio, wearable, IoT and other demanding applications that call for low power in small packages. The 1.2V products cover an operating voltage range from 1.14V to 1.3V, which is ideal for very-low-power designs, Winbond said. The 1.5V devices have a wider operating voltage range, from 1.14V through 1.6V. The first product in the family, the W25Q80NE at 8Mb density at 1.2V is available in samples and will be available in production in the beginning of 2018, according to Winbond. The rest of the family of products ranging from 1Mb through 128Mb density at 1.2V, and wide range from 1.5V to 1.2V will follow.
Wednesday 30 March 2016
Winbond SpiStack memories
Winbond Electronics has announced an expansion of its flash product portfolio with the introduction of a family of stackable SpiFlash memory devices. The new SpiStack W25M Series is Winbond's first to allow the "stacking" of homogeneous or heterogeneous flash, thus achieving memories of varying densities for code and/or data storage, while providing designers with the flash solutions most appropriate for their design requirements. The Winbond SpiStack W25M series provides a wide range of densities in the well-established 8-pin package to which designers are accustomed. Additionally, W25M memories feature the popular, multi-IO SpiFlash interface and command set. SpiStack homogeneous memories are achieved by stacking SpiFlash dies. For example, two 256Mb dies combining to form a single SpiFlash 512Mb NOR memory in the industry-standard 8-pin 8x6mm WSON package. Winbond's stacked product, W25M512JV, is also available in the widely used 16-pin SOIC or 24-pad BGA packages and is sampling now. SpiStack heterogeneous memories call for the stacking of a NOR memory with a NAND die, such as a 64Mb SpiFlash NOR blended with a 1Gb Serial NAND die, which gives designers the flexibility to store code in the NOR die and data in the NAND memory. Winbond's SpiFlash memory devices are manufactured at the company's 12-inch wafer fabrication facility in Taichung, Taiwan.
Dec 3, 10:53
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TSMC enters pilot production of 3nm chips
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TSMC outsources part of CoWoS packaging production to OSATs
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US-Taiwan Economic Prosperity Partner Dialogue to connect Taiwan companies with US telecoms
Taiwan top-3 foundries poised to see combined revenues increase 25% in 2021
Digitimes Research worldwide notebook shipment update – October 2021
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