Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.

Winbond Electronics has announced an expansion of its flash product portfolio with the introduction of its lowest-voltage SpiFlash memories to date. At 1.2 and 1.5V, and in 8-pin packages, these newest members of the SpiFlash family provide designers with serial flash memories for audio, wearable, IoT and other demanding applications that call for low power in small packages. The 1.2V products cover an operating voltage range from 1.14V to 1.3V, which is ideal for very-low-power designs, Winbond said. The 1.5V devices have a wider operating voltage range, from 1.14V through 1.6V. The first product in the family, the W25Q80NE at 8Mb density at 1.2V is available in samples and will be available in production in the beginning of 2018, according to Winbond. The rest of the family of products ranging from 1Mb through 128Mb density at 1.2V, and wide range from 1.5V to 1.2V will follow.

Toshiba has launched a new line-up of NAND flash memory products for embedded applications that are compatible with the Serial Peripheral Interface (SPI). Wide ranging applications for the new Serial Interface NAND include such consumer applications as flat-screen TVs, printers and wearable devices, and industrial applications, including robots. Users can choose from a line-up of 12 products that offers three densities, 1Gbit, 2Gbit and 4Gbit; two packages, WSON and SOP; and two power supply voltages. Compatibility with the SPI, which can be controlled with just six pins, allows the new Serial Interface NAND to be used as SLC NAND flash memory, with a low pin count, small package and large capacity. NOR flash memory is typically used in embedded applications for consumer and industrial devices. However, in order to realize extra functionality in embedded devices, demand is growing for larger memory densities for saving software (including boot up programs, firmware, and embedded OS) and data (including log data). This is driving demand for SLC NAND flash memory, which offers higher density and reliability and a lower bit cost than NOR flash memory.