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NEWS TAGGED PACKAGING AND TESTING
Tuesday 12 March 2024
Backend houses upbeat about orders for memory chips
With memory chipmakers ready to scale up output, industry sources indicated that backend houses are optimistic about orders from the memory sector beginning in the second quarter...
Wednesday 6 March 2024
KYEC upbeat about AI, HPC chip demand
According to King Yuan Electronics (KYEC), the IC testing specialist is bullish about the AI and HPC chip market. The company anticipates an increase in testing volume in the second...
Friday 23 February 2024
Backend house ChipMOS upbeat about 2024 memory market growth
The memory market will grow at a faster rate than the display driver IC (DDI) segment in 2024, according to ChipMOS Technologies, a backend house specializing in memory chips and...
Monday 19 February 2024
Backend house Lingsen sells Chinese subsidiary
Taiwan-based Lingsen Precision Industries, which specializes in power management IC, sensor, and memory module backend services, recently announced the sale of its subsidiary Ningbo...
Wednesday 31 January 2024
Backend house PTI gearing up for HBM chip production
Powertech Technology (PTI) will see its high-bandwidth memory (HBM) development project start contributing sales between the fourth quarter of 2024 and the first quarter of 2025,...