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Thursday 31 October 2024
Samsung, SK Hynix, Intel put packaging at the heart of future innovation
At SEDEX 2024 in Seoul, Samsung Electronics, SK Hynix, and Intel showcased advanced packaging technologies as essential for future semiconductor innovations. With a focus on AI and...
Wednesday 30 October 2024
Glass substrates poised to transform advanced packaging: Q&A with Corning commercial technology director Xavier Lafosse
The rapid development of AI has dramatically increased demand for AI chips, but current organic substrate technology faces challenges, including thermal expansion mismatches and warping,...
Wednesday 30 October 2024
Server ODMs focus on leak-proof liquid cooling solutions, says DIGITIMES Research
DIGITIMES Research believes that liquid cooling technology is transforming the server cooling supply chain ecosystem. Various industry players are actively positioning themselves...
Wednesday 30 October 2024
AMD doubles data center sales, but outlook disappoints
AMD released its latest financial results for the third quarter of 2024. Its revenue rose 18% compared to the same period last year to US$6.82 billion, surpassing the consensus estimate...
Tuesday 29 October 2024
Tesla's ambitious plans face regulatory and supply chain hurdles
Tesla's third-quarter results exceeded market expectations, with gross margins rising to 19.8%. The company attributed the performance to lower per-vehicle costs, but analysts highlighted...
Tuesday 29 October 2024
BYD's October surge boosts Taiwan's supply chain gains in Q4
BYD's new energy vehicle (NEV) sales excelled in October, buoying the performance of its Taiwanese suppliers in the fourth quarter of 2024, according to market sources.
Monday 28 October 2024
China's auto industry embraces local chip production with RISC-V architecture
China's automotive sector increasingly recognizes the critical importance of local chip production, prompting a shift towards the open-source RISC-V instruction set architecture....
Friday 25 October 2024
SK Hynix dismisses HBM oversupply concerns, deepens TSMC partnership for HBM4 development
SK Hynix delivered a record-breaking performance in the third quarter of 2024 with both revenue and operating profit reaching all-time highs, driven largely by its dominance in high...
Friday 25 October 2024
Qualcomm's new Snapdragon 8 Elite boosts Samsung's competitiveness while raising questions about Exynos future
Qualcomm's newly unveiled mobile application processor (AP), the Snapdragon 8 Elite, demonstrates significant performance improvements over its predecessor and reportedly surpasses...
Friday 25 October 2024
Micron PCIe Gen5 SSDs earn spot on Nvidia GB200 NVL72 vendor list
Micron Technology has announced that its 9550 PCIe Gen5 E1.S data center SSDs have been qualified for Nvidia's recommended vendor list (RVL) for the NVIDIA GB200 NVL72 system and...
Friday 25 October 2024
Qualcomm touts superior battery performance despite no new PC chips
Despite not announcing any new PC chips at this year's Snapdragon Summit, Qualcomm addressed performance claims made by Intel and AMD while sharing specifications for upcoming developments...
Thursday 24 October 2024
Micron anticipates AI demand boost as EUV-based DRAM enters production in 2025
Micron Technology, which has fully allocated its HBM production capacity for calendar 2025, indicated that demand for AI will increase as it expands from cloud servers to consumer...
Thursday 24 October 2024
SK Hynix maintains edge in HBM3E, but HBM4 certification and Samsung's pursuit pose risks
SK Hynix will announce its financial results for the third quarter of 2024 on October 24. During its previous earnings call, the company indicated that shipments of its HBM3E products...
Thursday 24 October 2024
SenseTime's AI data center heavily utilizes Chinese chips including Huawei, Biren
Chinese AI company SenseTime has announced that its Shanghai-based AI data center will extensively use domestically manufactured chips, including products from Huawei and Biren Technology...
Thursday 24 October 2024
Lam Research signals declining Chinese revenue, eyes growth in advanced manufacturing and packaging
Following ASML's report of declining net bookings and anticipated lower revenue from China, Lam Research refrained from providing updated guidance for its fiscal year. The company...
Holtek
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research