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Monday 4 November 2024
LG Innotek and Semco underperform for 3Q24; both pin their hopes on AI
The two major South Korean component suppliers, Samsung Electro-Mechanics (Semco) and LG Innotek, have released their financial reports for the third quarter of 2024, with performance...
Friday 1 November 2024
Samsung's foundry business faces challenges in catching up with TSMC
From the 14nm generation to the present, Samsung's attempts to capture Apple's orders have often been thwarted. Since the launch of Apple's A10 Fusion chip in 2016, TSMC has monopolized...
Friday 1 November 2024
Suzuki to supply made-in-India electric SUV to Toyota by early 2025
Toyota Motor and Suzuki Motor have partnered to launch a new battery electric SUV in spring 2025. The vehicle, to be produced in India, will feature a 60-kilowatt-hour battery and...
Friday 1 November 2024
Chinese automakers activate 'Plan B' as EU EV tariffs take effect
As the European Union implemented tariffs on Chinese electric vehicles on October 31, both European and Chinese EV supply chains have begun executing contingency plans. The tariffs...
Friday 1 November 2024
Micron spotlights Taiwan's 2 core strengths in supply chain strategy – a DIGITIMES exclusive
Global tech giants are increasing their investments in Taiwan, with Micron leading as the largest foreign investor. Over its 30-year presence, Micron has invested more than NT$1 trillion...
Friday 1 November 2024
Taiwan drone maker Carbon-Based turns to Asia as military contract pauses
Carbon-Based Technology recently delivered its "Albatross II" drone to Taiwan's Chung-Shan Institute of Science and Technology (NCSIST) alongside Air Asia Company Limited (AACL)....
Friday 1 November 2024
Supermicro's financial crisis unfolds, supply chain on the lookout for 2 key issues: An in-depth analysis
Supermicro faces mounting financial scrutiny following the resignation of its auditor, Ernst & Young (EY), over corporate governance and transparency concerns. While supply chain...
Friday 1 November 2024
Intel secures two design wins for 18A, but 0.4 defect density unfit for mass production
Intel's third-quarter results exceeded expectations amid ongoing cost reduction efforts. Intel secured two design wins from customers and shared its partnerships with AMD and TSMC.
Friday 1 November 2024
AUO to close NT$7.4bn Tainan plant sale to Micron by 2024's end
AUO has recently agreed to sell its Tainan plant to Micron for NT$7.4 billion (approx. US$228 million), with the transfer expected to be finalized by the end of 2024. AUO anticipates...
Friday 1 November 2024
Chinese officials urge EV makers to halt EU expansion amid rising trade tensions
Chinese officials are reportedly urging local electric vehicle (EV) manufacturers to suspend their expansion in the European Union (EU), potentially exacerbating future trade decoupling...
Friday 1 November 2024
China SiC industry faces restructuring; Taiwan firms seek differentiation
With SiC production capacity rising in China, prices have fallen dramatically, potentially leading to a restructuring of China's SiC industry and prompting Taiwan-based players to...
Thursday 31 October 2024
Taiwan-based Chenbro Micon sets up first plant in SEA
Server chassis manufacturer Chenbro Micom has initiated its manufacturing base diversification with a land-signing ceremony for its new factory in Malaysia on October 30.
Thursday 31 October 2024
Monitor panel prices expected to decline until year-end amid weak demand
While China's recent "trade-in" subsidy policy has boosted demand for large-size TVs, stabilizing LCD TV panel prices, monitor panel prices continue to decline amid weak IT demand...
Thursday 31 October 2024
Second place foundry stakes: Samsung and Intel seek strategic overhaul under TSMC's shadow
Regardless of Samsung and Intel's third-quarter earnings, the real story isn't in comparing them to TSMC. What's critical now is each company's internal recalibration and its leadership's...
Wednesday 30 October 2024
Global CoWoS and CoWoS-like packaging capacity demand to surge 113% on year in 2025, says DIGITIMES Research
Global demand for Chip-on-Wafer-on-Substrate (CoWoS) and CoWoS-like packaging capacity will likely grow by 113% annually in 2025, driven by robust demand for cloud AI accelerators,...
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research