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Thursday 7 November 2024
Chinese lithium battery makers face domestic price wars amid global expansion hurdles
Despite their dominance of over 60% of the global lithium battery market, Chinese manufacturers are increasingly seeking to expand abroad to escape fierce competition and price wars...
Thursday 7 November 2024
Toyota suppliers cut fiscal guidance amid sluggish sales and production cuts
Toyota's major automotive component suppliers have revised their financial guidance downward for the fiscal year ending in March, according to their latest financial results.
Thursday 7 November 2024
Observing Germany's top industry player Zeiss
I recently attended Zeiss's Quality Innovation Summit in Berlin, where I delivered a one-hour presentation titled "Reshaping Global ICT Supply Chain." Through arrangements made by...
Thursday 7 November 2024
European automakers face continued challenges in auto industry electrification
The transition of Europe's automotive industry to electric has encountered challenges in 2024, leading to significant setbacks for European car manufacturers. To date, European automakers...
Thursday 7 November 2024
Trump's economic revival sparks uncertainty in tech sector
As Donald Trump secures a second term as US president, market observers are closely monitoring the potential impact of his economic policies on the technology sector. With Republican...
Thursday 7 November 2024
Peter Chen insight: Qisda prepares for Trump's 'Tariff 2.0' and US manufacturing shift in 2025
Donald Trump's potential return as the US President has captured global attention. Peter Chen, chairperson of Qisda, notes that from an economic and industrial perspective, Trump's...
Wednesday 6 November 2024
HBM and beyond: SK Hynix deepens strategic partnership with TSMC
SK Hynix has strengthened its collaboration with TSMC, designating the foundry to manufacture its next-generation HBM4 logic die. The company's development of high-capacity Compute...
Wednesday 6 November 2024
SK Hynix reduces DDR4 production, accelerates shift to AI memory
SK Hynix plans to reduce its legacy DRAM production to 20% by the fourth quarter of 2024, responding to increased supply and pricing pressure from Chinese memory manufacturers. The...
Wednesday 6 November 2024
AP Memory seeks to capitalize on robust HPC and AI chip demand
Memory intellectual property (IP) firm AP Memory Technology has seen AI drive an uptick in sales, even as its IoT business has yet to rebound. With quarterly gross margin back on...
Wednesday 6 November 2024
Samsung's new semiconductor R&D campus to launch, driving next-gen memory development
Samsung Electronics plans to open its new semiconductor research and development campus in mid-November. The installation of advanced equipment is set to take place from November...
Tuesday 5 November 2024
SDC advances its 8.6G IT OLED mass production plan to 2025
Samsung Display (SDC) plans to accelerate the production of its 8.6G OLED panels for IT applications, which will first be utilized in Samsung Electronics' notebook products.
Tuesday 5 November 2024
Nvidia's Jensen Huang requests early shipment of HBM4 from SK Hynix
Nvidia CEO Jensen Huang emphasized during a video call at the SK AI Summit in Seoul's Coex that he aims to strengthen collaboration with SK Hynix in the high bandwidth memory (HBM)...
Tuesday 5 November 2024
2024 memory market trends: A timeline characterized by AI demand and rising prices
The memory technology market has experienced significant fluctuations in recent years, marked by production cuts and shifting prices. The beginning of 2024 saw a gradual recovery,...
Tuesday 5 November 2024
Micro LED's massive application potential reaches turning point, says AUO chairman
As AUO (AU Optronics) undergoes a strategic transformation, the company maintains a cautious stance on fan-out panel level packaging (FOPLP) but shows increased optimism about silicon...
Monday 4 November 2024
Samsung and SK Hynix heat up next-gen memory race with cryogenic etching breakthroughs
Samsung Electronics and SK Hynix are advancing next-generation memory technology with "ultra-low-temperature" etching, a technique initially applied to high-density, multi-layer NAND...